NXP USA Inc. P1025NXN5DFB

P1025NXN5DFB Overview
The package or case for this particular component is a 561-FBGA, which stands for Fine Pitch Ball Grid Array. It is typically used for integrated circuits and offers a high-density packaging solution. The packaging for this component is a tray, which is a type of container used for shipping and storing electronic components. The part status is listed as obsolete, meaning it is no longer in production. The base part number is P1025, which is a specific model or version of the component. It has a speed of 667MHz, meaning it can process data at a rate of 667 million cycles per second. The Ethernet capabilities are 10/100/1000Mbps, indicating it can support data transfer speeds of 10, 100, or 1000 megabits per second. It has 2 cores with a 32-bit bus width, meaning it has two processing units and can handle data in 32-bit chunks. The USB capabilities include USB 2.0 and a PHY, which stands for physical layer interface. This means it can support USB 2.0 technology and has a physical interface for connecting to other devices. It also has co-processors or a digital signal processor (DSP) for handling communication tasks, specifically the QUICC Engine. Lastly, it is listed as RoHS3 compliant, meaning it meets the requirements for the Restriction of Hazardous Substances directive.

P1025NXN5DFB Features
PowerPC e500v2 Core

P1025NXN5DFB Applications
There are a lot of NXP USA Inc. P1025NXN5DFB Microprocessor applications.

Communication-bluetooth, Wi-Fi, radio
Data acquisition and control
Fabric
Mice
Process control devices
Food and beverage
Medical instruments
Routers
Accu-check
Entertainment products