OMAP5912ZZG

Texas Instruments OMAP5912ZZG

Part Number:
OMAP5912ZZG
Manufacturer:
Texas Instruments
Ventron No:
3667347-OMAP5912ZZG
Description:
IC MPU OMAP-59XX 192MHZ 289BGA
ECAD Model:
Datasheet:
OMAP5912ZZG

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Specifications
Texas Instruments OMAP5912ZZG technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments OMAP5912ZZG.
  • Factory Lead Time
    20 Weeks
  • Mount
    Surface Mount
  • Package / Case
    289-TFBGA
  • Number of Pins
    289
  • Weight
    274.791928mg
  • Operating Temperature
    -40°C~85°C TC
  • Packaging
    Tray
  • Series
    OMAP-59xx
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    289
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Digital Signal Processors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.6V
  • Terminal Pitch
    0.5mm
  • Frequency
    192MHz
  • Base Part Number
    OMAP5912
  • Pin Count
    289
  • Operating Supply Voltage
    3.3V
  • Voltage
    1.65V
  • Interface
    I2C, MMC, SDIO, UART, USB
  • Memory Size
    24kB
  • Nominal Supply Current
    326mA
  • RAM Size
    250kB
  • Memory Type
    FLASH
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, MIXED
  • Core Processor
    ARM926EJ-S
  • Bit Size
    16
  • Data Bus Width
    32b
  • Number of Timers/Counters
    6
  • Address Bus Width
    26
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    1.8V 2.75V 3.3V
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    LPDDR
  • USB
    USB 1.1 (1), USB 1.x (2)
  • Additional Interfaces
    1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD/SDIO, SPI, UART
  • Co-Processors/DSP
    Signal Processing; C55x, System Control; CP15
  • Barrel Shifter
    NO
  • Internal Bus Architecture
    MULTIPLE
  • Security Features
    Cryptography, Random Number Generator
  • Display & Interface Controllers
    Keyboard, LCD
  • Number of DMA Channels
    6
  • Height Seated (Max)
    1.2mm
  • Length
    12mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
OMAP5912ZZG Overview
Texas Instruments is a well-known brand in the technology industry, particularly in the field of microprocessors. Their products are highly regarded for their reliability, efficiency, and advanced features. One of their latest offerings is the Embedded - Microprocessors chip, which falls under the category of Embedded - Microprocessors. This chip is designed to provide high performance and versatility for a wide range of applications. One of the key parameters of this chip is the number of terminations, which is 289. This indicates the number of connections available for external devices to be connected to the chip. With a high number of terminations, this chip can support a large number of peripherals, making it suitable for complex systems. The terminal position of this chip is at the bottom, which means that it is mounted on the bottom side of the circuit board. This allows for efficient heat dissipation and better space utilization on the board. The terminal pitch, which is the distance between two adjacent terminals, is 0.5mm. This is a relatively small pitch, indicating that the chip is designed for compact and space-constrained applications. In terms of memory, this chip uses FLASH technology, which is known for its fast read and write speeds, as well as its non-volatile storage capabilities. This makes it ideal for applications that require frequent data storage and retrieval. The bit size of this chip is 16, which refers to the number of bits that can be processed in a single instruction. This indicates that the chip is capable of handling complex operations and can support a wide range of software applications. Another important parameter of this chip is its support for boundary scan. This feature allows for efficient testing and debugging of the chip during the manufacturing process, ensuring high quality and reliability. While this chip does not have graphics acceleration capabilities, it offers a wide range of additional interfaces such as 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD/SDIO, SPI, and UART. These interfaces enable seamless communication with various external devices, making the chip highly versatile and adaptable for different applications. One parameter that this chip does not have is a barrel shifter, which is a hardware component that enables efficient data shifting operations. However, this does not affect the overall performance of the chip as it is designed to handle complex operations without the need for a barrel shifter. In terms of physical dimensions, this chip has a length of 12mm. This compact size makes it suitable for applications where space is limited, without compromising on performance. In conclusion, the Texas Instruments Embedded - Microprocessors chip offers a wide range of parameters that make it a highly versatile and efficient choice for various applications. With its advanced features and reliable performance, it is a top choice for engineers and developers in the technology industry.

OMAP5912ZZG Features
ARM926EJ-S Core
16-Bit Structure
32b-Bit Data Bus Width
250kB RAM

OMAP5912ZZG Applications
There are a lot of Texas Instruments OMAP5912ZZG Microprocessor applications.

Safety field
Dryers
Removable disks
Office automation equipment and computer peripherals
Projectors
Television
Sonography (Ultrasound imaging)
Pacemakers (used to control abnormal heart rhythm)
Fire detection & safety devices
Heater/Fan
OMAP5912ZZG More Descriptions
DSP- C5000 Power Efficient Applications Processor
Applications Processor 289-Pin BGA MICROSTAR
SOC OMAP5 ARM926EJ-S 0.13um 289-Pin BGA MICROSTAR Tray
IC MPU OMAP-59XX 192MHZ 289BGA
OMAP5912, UBGA 12 X12, P0.50, PBFOMAP5912 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices. The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution. The dual-core architecture provides benefits of both DSP and reduced instruction set computer (RISC)technologies, incorporating a TMS320C55x DSP core and a high-performance ARM926EJ-S ARM core.
Product Comparison
The three parts on the right have similar specifications to OMAP5912ZZG.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Package / Case
    Number of Pins
    Weight
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Base Part Number
    Pin Count
    Operating Supply Voltage
    Voltage
    Interface
    Memory Size
    Nominal Supply Current
    RAM Size
    Memory Type
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Bit Size
    Data Bus Width
    Number of Timers/Counters
    Address Bus Width
    Boundary Scan
    Low Power Mode
    Format
    Integrated Cache
    Voltage - I/O
    Number of Cores/Bus Width
    Graphics Acceleration
    RAM Controllers
    USB
    Additional Interfaces
    Co-Processors/DSP
    Barrel Shifter
    Internal Bus Architecture
    Security Features
    Display & Interface Controllers
    Number of DMA Channels
    Height Seated (Max)
    Length
    RoHS Status
    Lead Free
    Pbfree Code
    Max Supply Voltage
    Min Supply Voltage
    Core Architecture
    Number of UART Channels
    Radiation Hardening
    View Compare
  • OMAP5912ZZG
    OMAP5912ZZG
    20 Weeks
    Surface Mount
    289-TFBGA
    289
    274.791928mg
    -40°C~85°C TC
    Tray
    OMAP-59xx
    e1
    Active
    4 (72 Hours)
    289
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.31.00.01
    Digital Signal Processors
    CMOS
    BOTTOM
    BALL
    260
    1.6V
    0.5mm
    192MHz
    OMAP5912
    289
    3.3V
    1.65V
    I2C, MMC, SDIO, UART, USB
    24kB
    326mA
    250kB
    FLASH
    DIGITAL SIGNAL PROCESSOR, MIXED
    ARM926EJ-S
    16
    32b
    6
    26
    YES
    YES
    FIXED POINT
    YES
    1.8V 2.75V 3.3V
    1 Core 32-Bit
    No
    LPDDR
    USB 1.1 (1), USB 1.x (2)
    1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD/SDIO, SPI, UART
    Signal Processing; C55x, System Control; CP15
    NO
    MULTIPLE
    Cryptography, Random Number Generator
    Keyboard, LCD
    6
    1.2mm
    12mm
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
  • OMAP3503DCBCA
    -
    Surface Mount
    515-VFBGA, FCBGA
    515
    -
    -40°C~105°C TJ
    Tray
    OMAP-35xx
    e1
    Obsolete
    1 (Unlimited)
    515
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    Graphics Processors
    CMOS
    BOTTOM
    BALL
    260
    1.8V
    0.4mm
    600MHz
    OMAP3503
    515
    -
    1.35V
    I2C, MMC, SDIO, UART, USB
    -
    -
    64kB
    L2 Cache, ROM, SRAM
    DIGITAL SIGNAL PROCESSOR, OTHER
    ARM® Cortex®-A8
    -
    32b
    12
    26
    YES
    YES
    FLOATING POINT
    -
    1.8V 3.0V
    1 Core 32-Bit
    No
    LPDDR
    USB 1.x (3), USB 2.0 (1)
    HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
    Multimedia; NEON™ SIMD
    NO
    SINGLE
    -
    LCD
    -
    0.9mm
    -
    ROHS3 Compliant
    Contains Lead
    no
    1.89V
    1.71V
    ARM
    3
    -
  • OMAP2531BZAC400CSC
    16 Weeks
    -
    -
    -
    -
    -
    -
    -
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    OMAP2531
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
  • OMAP3515DCUSA
    -
    Surface Mount
    423-LFBGA, FCBGA
    423
    -
    -40°C~105°C TJ
    Tray
    OMAP-35xx
    e1
    Obsolete
    4 (72 Hours)
    423
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    Graphics Processors
    CMOS
    BOTTOM
    BALL
    260
    1.8V
    0.65mm
    600MHz
    OMAP3515
    423
    -
    1.35V
    -
    -
    -
    64kB
    L2 Cache, ROM, SRAM
    DIGITAL SIGNAL PROCESSOR, OTHER
    ARM® Cortex®-A8
    -
    32b
    -
    -
    YES
    YES
    FLOATING POINT
    -
    1.8V 3.0V
    1 Core 32-Bit
    Yes
    LPDDR
    USB 1.x (3), USB 2.0 (1)
    HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
    Multimedia; NEON™ SIMD
    NO
    MULTIPLE
    -
    LCD
    -
    1.4mm
    16mm
    ROHS3 Compliant
    Contains Lead
    no
    1.89V
    1.71V
    ARM
    3
    No
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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