Texas Instruments OMAP5912ZZG
- Part Number:
- OMAP5912ZZG
- Manufacturer:
- Texas Instruments
- Ventron No:
- 3667347-OMAP5912ZZG
- Description:
- IC MPU OMAP-59XX 192MHZ 289BGA
- Datasheet:
- OMAP5912ZZG
Texas Instruments OMAP5912ZZG technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments OMAP5912ZZG.
- Factory Lead Time20 Weeks
- MountSurface Mount
- Package / Case289-TFBGA
- Number of Pins289
- Weight274.791928mg
- Operating Temperature-40°C~85°C TC
- PackagingTray
- SeriesOMAP-59xx
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations289
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.31.00.01
- SubcategoryDigital Signal Processors
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.6V
- Terminal Pitch0.5mm
- Frequency192MHz
- Base Part NumberOMAP5912
- Pin Count289
- Operating Supply Voltage3.3V
- Voltage1.65V
- InterfaceI2C, MMC, SDIO, UART, USB
- Memory Size24kB
- Nominal Supply Current326mA
- RAM Size250kB
- Memory TypeFLASH
- uPs/uCs/Peripheral ICs TypeDIGITAL SIGNAL PROCESSOR, MIXED
- Core ProcessorARM926EJ-S
- Bit Size16
- Data Bus Width32b
- Number of Timers/Counters6
- Address Bus Width26
- Boundary ScanYES
- Low Power ModeYES
- FormatFIXED POINT
- Integrated CacheYES
- Voltage - I/O1.8V 2.75V 3.3V
- Number of Cores/Bus Width1 Core 32-Bit
- Graphics AccelerationNo
- RAM ControllersLPDDR
- USBUSB 1.1 (1), USB 1.x (2)
- Additional Interfaces1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD/SDIO, SPI, UART
- Co-Processors/DSPSignal Processing; C55x, System Control; CP15
- Barrel ShifterNO
- Internal Bus ArchitectureMULTIPLE
- Security FeaturesCryptography, Random Number Generator
- Display & Interface ControllersKeyboard, LCD
- Number of DMA Channels6
- Height Seated (Max)1.2mm
- Length12mm
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
OMAP5912ZZG Overview
Texas Instruments is a well-known brand in the technology industry, particularly in the field of microprocessors. Their products are highly regarded for their reliability, efficiency, and advanced features. One of their latest offerings is the Embedded - Microprocessors chip, which falls under the category of Embedded - Microprocessors. This chip is designed to provide high performance and versatility for a wide range of applications. One of the key parameters of this chip is the number of terminations, which is 289. This indicates the number of connections available for external devices to be connected to the chip. With a high number of terminations, this chip can support a large number of peripherals, making it suitable for complex systems. The terminal position of this chip is at the bottom, which means that it is mounted on the bottom side of the circuit board. This allows for efficient heat dissipation and better space utilization on the board. The terminal pitch, which is the distance between two adjacent terminals, is 0.5mm. This is a relatively small pitch, indicating that the chip is designed for compact and space-constrained applications. In terms of memory, this chip uses FLASH technology, which is known for its fast read and write speeds, as well as its non-volatile storage capabilities. This makes it ideal for applications that require frequent data storage and retrieval. The bit size of this chip is 16, which refers to the number of bits that can be processed in a single instruction. This indicates that the chip is capable of handling complex operations and can support a wide range of software applications. Another important parameter of this chip is its support for boundary scan. This feature allows for efficient testing and debugging of the chip during the manufacturing process, ensuring high quality and reliability. While this chip does not have graphics acceleration capabilities, it offers a wide range of additional interfaces such as 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD/SDIO, SPI, and UART. These interfaces enable seamless communication with various external devices, making the chip highly versatile and adaptable for different applications. One parameter that this chip does not have is a barrel shifter, which is a hardware component that enables efficient data shifting operations. However, this does not affect the overall performance of the chip as it is designed to handle complex operations without the need for a barrel shifter. In terms of physical dimensions, this chip has a length of 12mm. This compact size makes it suitable for applications where space is limited, without compromising on performance. In conclusion, the Texas Instruments Embedded - Microprocessors chip offers a wide range of parameters that make it a highly versatile and efficient choice for various applications. With its advanced features and reliable performance, it is a top choice for engineers and developers in the technology industry.
OMAP5912ZZG Features
ARM926EJ-S Core
16-Bit Structure
32b-Bit Data Bus Width
250kB RAM
OMAP5912ZZG Applications
There are a lot of Texas Instruments OMAP5912ZZG Microprocessor applications.
Safety field
Dryers
Removable disks
Office automation equipment and computer peripherals
Projectors
Television
Sonography (Ultrasound imaging)
Pacemakers (used to control abnormal heart rhythm)
Fire detection & safety devices
Heater/Fan
Texas Instruments is a well-known brand in the technology industry, particularly in the field of microprocessors. Their products are highly regarded for their reliability, efficiency, and advanced features. One of their latest offerings is the Embedded - Microprocessors chip, which falls under the category of Embedded - Microprocessors. This chip is designed to provide high performance and versatility for a wide range of applications. One of the key parameters of this chip is the number of terminations, which is 289. This indicates the number of connections available for external devices to be connected to the chip. With a high number of terminations, this chip can support a large number of peripherals, making it suitable for complex systems. The terminal position of this chip is at the bottom, which means that it is mounted on the bottom side of the circuit board. This allows for efficient heat dissipation and better space utilization on the board. The terminal pitch, which is the distance between two adjacent terminals, is 0.5mm. This is a relatively small pitch, indicating that the chip is designed for compact and space-constrained applications. In terms of memory, this chip uses FLASH technology, which is known for its fast read and write speeds, as well as its non-volatile storage capabilities. This makes it ideal for applications that require frequent data storage and retrieval. The bit size of this chip is 16, which refers to the number of bits that can be processed in a single instruction. This indicates that the chip is capable of handling complex operations and can support a wide range of software applications. Another important parameter of this chip is its support for boundary scan. This feature allows for efficient testing and debugging of the chip during the manufacturing process, ensuring high quality and reliability. While this chip does not have graphics acceleration capabilities, it offers a wide range of additional interfaces such as 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD/SDIO, SPI, and UART. These interfaces enable seamless communication with various external devices, making the chip highly versatile and adaptable for different applications. One parameter that this chip does not have is a barrel shifter, which is a hardware component that enables efficient data shifting operations. However, this does not affect the overall performance of the chip as it is designed to handle complex operations without the need for a barrel shifter. In terms of physical dimensions, this chip has a length of 12mm. This compact size makes it suitable for applications where space is limited, without compromising on performance. In conclusion, the Texas Instruments Embedded - Microprocessors chip offers a wide range of parameters that make it a highly versatile and efficient choice for various applications. With its advanced features and reliable performance, it is a top choice for engineers and developers in the technology industry.
OMAP5912ZZG Features
ARM926EJ-S Core
16-Bit Structure
32b-Bit Data Bus Width
250kB RAM
OMAP5912ZZG Applications
There are a lot of Texas Instruments OMAP5912ZZG Microprocessor applications.
Safety field
Dryers
Removable disks
Office automation equipment and computer peripherals
Projectors
Television
Sonography (Ultrasound imaging)
Pacemakers (used to control abnormal heart rhythm)
Fire detection & safety devices
Heater/Fan
OMAP5912ZZG More Descriptions
DSP- C5000 Power Efficient Applications Processor
Applications Processor 289-Pin BGA MICROSTAR
SOC OMAP5 ARM926EJ-S 0.13um 289-Pin BGA MICROSTAR Tray
IC MPU OMAP-59XX 192MHZ 289BGA
OMAP5912, UBGA 12 X12, P0.50, PBFOMAP5912 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices. The OMAP platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution. The dual-core architecture provides benefits of both DSP and reduced instruction set computer (RISC)technologies, incorporating a TMS320C55x DSP core and a high-performance ARM926EJ-S ARM core.
Applications Processor 289-Pin BGA MICROSTAR
SOC OMAP5 ARM926EJ-S 0.13um 289-Pin BGA MICROSTAR Tray
IC MPU OMAP-59XX 192MHZ 289BGA
OMAP5912, UBGA 12 X12, P0.50, PBF
The three parts on the right have similar specifications to OMAP5912ZZG.
-
ImagePart NumberManufacturerFactory Lead TimeMountPackage / CaseNumber of PinsWeightOperating TemperaturePackagingSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyBase Part NumberPin CountOperating Supply VoltageVoltageInterfaceMemory SizeNominal Supply CurrentRAM SizeMemory TypeuPs/uCs/Peripheral ICs TypeCore ProcessorBit SizeData Bus WidthNumber of Timers/CountersAddress Bus WidthBoundary ScanLow Power ModeFormatIntegrated CacheVoltage - I/ONumber of Cores/Bus WidthGraphics AccelerationRAM ControllersUSBAdditional InterfacesCo-Processors/DSPBarrel ShifterInternal Bus ArchitectureSecurity FeaturesDisplay & Interface ControllersNumber of DMA ChannelsHeight Seated (Max)LengthRoHS StatusLead FreePbfree CodeMax Supply VoltageMin Supply VoltageCore ArchitectureNumber of UART ChannelsRadiation HardeningView Compare
-
OMAP5912ZZG20 WeeksSurface Mount289-TFBGA289274.791928mg-40°C~85°C TCTrayOMAP-59xxe1Active4 (72 Hours)289Tin/Silver/Copper (Sn/Ag/Cu)8542.31.00.01Digital Signal ProcessorsCMOSBOTTOMBALL2601.6V0.5mm192MHzOMAP59122893.3V1.65VI2C, MMC, SDIO, UART, USB24kB326mA250kBFLASHDIGITAL SIGNAL PROCESSOR, MIXEDARM926EJ-S1632b626YESYESFIXED POINTYES1.8V 2.75V 3.3V1 Core 32-BitNoLPDDRUSB 1.1 (1), USB 1.x (2)1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD/SDIO, SPI, UARTSignal Processing; C55x, System Control; CP15NOMULTIPLECryptography, Random Number GeneratorKeyboard, LCD61.2mm12mmROHS3 CompliantLead Free-------
-
-Surface Mount515-VFBGA, FCBGA515--40°C~105°C TJTrayOMAP-35xxe1Obsolete1 (Unlimited)515Tin/Silver/Copper (Sn/Ag/Cu)-Graphics ProcessorsCMOSBOTTOMBALL2601.8V0.4mm600MHzOMAP3503515-1.35VI2C, MMC, SDIO, UART, USB--64kBL2 Cache, ROM, SRAMDIGITAL SIGNAL PROCESSOR, OTHERARM® Cortex®-A8-32b1226YESYESFLOATING POINT-1.8V 3.0V1 Core 32-BitNoLPDDRUSB 1.x (3), USB 2.0 (1)HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UARTMultimedia; NEON™ SIMDNOSINGLE-LCD-0.9mm-ROHS3 CompliantContains Leadno1.89V1.71VARM3-
-
16 Weeks--------Active3 (168 Hours)-----------OMAP2531--------------------------------ROHS3 Compliant-------
-
-Surface Mount423-LFBGA, FCBGA423--40°C~105°C TJTrayOMAP-35xxe1Obsolete4 (72 Hours)423Tin/Silver/Copper (Sn/Ag/Cu)-Graphics ProcessorsCMOSBOTTOMBALL2601.8V0.65mm600MHzOMAP3515423-1.35V---64kBL2 Cache, ROM, SRAMDIGITAL SIGNAL PROCESSOR, OTHERARM® Cortex®-A8-32b--YESYESFLOATING POINT-1.8V 3.0V1 Core 32-BitYesLPDDRUSB 1.x (3), USB 2.0 (1)HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UARTMultimedia; NEON™ SIMDNOMULTIPLE-LCD-1.4mm16mmROHS3 CompliantContains Leadno1.89V1.71VARM3No
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
14 November 2023
BAT54S Schottky Diode Structure, Technical Parameters, Package and Other Details
Ⅰ. Overview of BAT54S diodeⅡ. BAT54S symbol, footprint and pin configurationⅢ. Structure and working principle of BAT54S diodeⅣ. What are the features of BAT54S diode?Ⅴ. Technical parameters of... -
14 November 2023
HX711 Load Cell Amplifier: Symbol, Manufacturer, Working Principle and Applications
Ⅰ. Overview of HX711Ⅱ. HX711 symbol, footprint and pin configurationⅢ. Manufacturer of HX711Ⅳ. Features of HX711Ⅴ. Technical parameters of HX711Ⅵ. Working principle of HX711 pressure sensorⅦ. Internal block... -
15 November 2023
An Introduction to USB to Serial Converter Module CP2102
Ⅰ. Overview of CP2102Ⅱ. Manufacturer of CP2102Ⅲ. CP2102 symbol, footprint and pin configurationⅣ. Features of CP2102Ⅴ. Technical parameters of CP2102Ⅵ. What are the advantages of CP2102?Ⅶ. What is... -
15 November 2023
S9015 PNP Transistor Equivalents, Structure, S9015 vs C9015 and More
Ⅰ. Overview of S9015 transistorⅡ. Structure and working principle of S9015 transistorⅢ. Pin configuration of S9015 transistorⅣ. Features of S9015 transistorⅤ. Technical parameters of S9015 transistorⅥ. Absolute maximum...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.