MPC875ZT80

NXP USA Inc. MPC875ZT80

Part Number:
MPC875ZT80
Manufacturer:
NXP USA Inc.
Ventron No:
3160976-MPC875ZT80
Description:
IC MPU MPC8XX 80MHZ 256BGA
ECAD Model:
Datasheet:
MPC875,870 Hardware Spec

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Specifications
NXP USA Inc. MPC875ZT80 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC875ZT80.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    256-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TA
  • Packaging
    Tray
  • Published
    1999
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    5A002.A.1
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC875
  • JESD-30 Code
    S-PBGA-B256
  • Supply Voltage-Max (Vsup)
    1.9V
  • Power Supplies
    1.83.3V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Speed
    80MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (1), 10/100Mbps (2)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • USB
    USB 2.0 (1)
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM, Security; SEC
  • Security Features
    Cryptography
  • Height Seated (Max)
    2.54mm
  • Length
    23mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC875ZT80 Overview
The MPC875 is a high-performance microprocessor designed for a wide range of applications. It features a 256-BBGA package, making it suitable for surface mount installation. With an operating temperature range of 0°C~95°C TA and a JESD-609 Code of e0, this microprocessor is capable of functioning in various environments. Its terminal finish is Tin/Lead (Sn/Pb), and it utilizes CMOS technology. The base part number for this product is MPC875. Additionally, it offers a low power mode for energy efficiency and has 1 core with a 32-bit bus width. The MPC875 also features a USB 2.0 (1) interface for easy connectivity. With these advanced features, the MPC875 is a reliable and versatile choice for your microprocessor needs.

MPC875ZT80 Features
32-Bit Structure

MPC875ZT80 Applications
There are a lot of NXP USA Inc. MPC875ZT80 Microprocessor applications.

Mobile computers
DDC control
Removable disks
Computers and laptops-video calling, email, blogging
Entertainment products
Industrial instrumentation devices
8. Navigation control field
Office automation equipment and computer peripherals
Speed meter
Heart rate monitors
MPC875ZT80 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.18um 80MHz 3.3V 256-Pin BGA Tray
FIXED POINT MICROPROCESSOR RISC USB 2.0 (1) BALL IC Microprocessor 0C~95C TA 23mm 1.7V 80MHz
RISC Microprocessor, 32-Bit, 80MHz, CMOS, PBGA256
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 256-PBGA (23x23)
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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