MPC875CZT66

NXP USA Inc. MPC875CZT66

Part Number:
MPC875CZT66
Manufacturer:
NXP USA Inc.
Ventron No:
3667099-MPC875CZT66
Description:
IC MPU MPC8XX 66MHZ 256BGA
ECAD Model:
Datasheet:
MPC875,870 Hardware Spec

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Specifications
NXP USA Inc. MPC875CZT66 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC875CZT66.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    256-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TA
  • Packaging
    Tray
  • Published
    1999
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    5A002.A.1
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC875
  • JESD-30 Code
    S-PBGA-B256
  • Supply Voltage-Max (Vsup)
    1.9V
  • Power Supplies
    1.83.3V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Speed
    66MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (1), 10/100Mbps (2)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • USB
    USB 2.0 (1)
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM, Security; SEC
  • Security Features
    Cryptography
  • Height Seated (Max)
    2.54mm
  • Length
    23mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC875CZT66 Overview
The MPC8xx series is a group of microprocessors designed for use in a variety of electronic devices. These processors adhere to the JESD-609 Code, which specifies the requirements for the handling, packing, and shipping of electronic devices. The terminal finish for these processors is Tin/Lead (Sn/Pb), a common choice for its reliability and low cost. The technology used in these processors is CMOS, which is known for its low power consumption and high speed. The terminal position for these processors is located on the bottom, making it easy to integrate into various circuit boards. The peak reflow temperature for these processors is 245 degrees Celsius, with a maximum reflow time of 30 seconds. This is in accordance with the JESD-30 Code, which outlines the standard reflow profile for electronic components. These processors require a power supply of 1.83.3V, with a voltage for input/output of 3.3V. This makes them suitable for a wide range of applications, from mobile devices to industrial equipment.

MPC875CZT66 Features
32-Bit Structure

MPC875CZT66 Applications
There are a lot of NXP USA Inc. MPC875CZT66 Microprocessor applications.

Mice
Laminators
Nintendo
Routers
Vacuum cleaners
Set-top boxes
Smoke alarms
Measurement and control field
Multi-meter
Auto-breaking system
MPC875CZT66 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.18um 66MHz 3.3V 256-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)
PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 100C
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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