Home > Products > Integrated Circuits (ICs) > Embedded - Microprocessors > MPC870CZT66
MPC870CZT66

NXP USA Inc. MPC870CZT66

Part Number:
MPC870CZT66
Manufacturer:
NXP USA Inc.
Ventron No:
3827660-MPC870CZT66
Description:
IC MPU MPC8XX 66MHZ 256BGA
ECAD Model:
Datasheet:
MPC875,870 Hardware Spec

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
NXP USA Inc. MPC870CZT66 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC870CZT66.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    256-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TA
  • Packaging
    Tray
  • Published
    1999
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    5A992
  • Terminal Finish
    TIN LEAD
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC870
  • JESD-30 Code
    S-PBGA-B256
  • Supply Voltage-Max (Vsup)
    1.9V
  • Power Supplies
    1.83.3V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Speed
    66MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10/100Mbps (2)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • USB
    USB 2.0 (1)
  • Additional Interfaces
    I2C, PCMCIA, SPI, TDM, UART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.54mm
  • Length
    23mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC870CZT66 Overview
The terminal finish for this product is TIN LEAD, providing a reliable and durable coating for the terminals. The terminal form is BALL, ensuring a secure and stable connection for the product. With a peak reflow temperature of 245°C and a maximum reflow time of 30 seconds, this product can withstand high temperatures during the manufacturing process. The supply voltage ranges from 1.7V to 1.9V, making it suitable for a variety of applications. With a speed of 66MHz and a voltage of 3.3V for I/O, this product offers fast and efficient performance. It also features additional interfaces such as I2C, PCMCIA, SPI, TDM, and UART, providing versatile connectivity options. Furthermore, it supports Ethernet with speeds of 10/100Mbps (2), making it ideal for networking applications.

MPC870CZT66 Features
32-Bit Structure

MPC870CZT66 Applications
There are a lot of NXP USA Inc. MPC870CZT66 Microprocessor applications.

Hard drives
Aerospace navigation systems
Pacemakers (used to control abnormal heart rhythm)
Process control devices
Digital TVs
Process control devices
Automatic control
X-ray
Automatic staplers
Heater/Fan
MPC870CZT66 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.18um 66MHz 3.3V 256-Pin BGA Tray
FIXED POINT MICROPROCESSOR RISC USB 2.0 (1) BALL IC Microprocessor -40C~100C TA 23mm 1.7V 66MHz
PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 100C
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
Popular Search Part Number Related Keywords Search Tags

Latest News

  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.