NXP USA Inc. MPC860TZQ50D4

Name: MPC860TZQ50D4
Brand: NXP USA Inc.
SKU: 3667546-MPC860TZQ50D4
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: MPC860TZQ50D4

Manufacturer:: NXP USA Inc.

Ventron No:: 3667546-MPC860TZQ50D4

Description:: IC MPU MPC8XX 50MHZ 357BGA

ECAD Model:

Datasheet:: MPC860TZQ50D4

Specifications

NXP USA Inc. MPC860TZQ50D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860TZQ50D4.

Factory Lead Time
12 Weeks
Package / Case
357-BBGA
Surface Mount
YES
Operating Temperature
0°C~95°C TA
Packaging
Tray
Published
1995
Series
MPC8xx
JESD-609 Code
e0
Part Status
Not For New Designs
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
357
ECCN Code
3A991.A.2
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
HTS Code
8542.31.00.01
Subcategory
Microprocessors
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
3.3V
Terminal Pitch
1.27mm
Reflow Temperature-Max (s)
30
Base Part Number
MPC860
JESD-30 Code
S-PBGA-B357
Supply Voltage-Max (Vsup)
3.465V
Power Supplies
3.3V
Supply Voltage-Min (Vsup)
3.135V
Speed
50MHz
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Clock Frequency
50MHz
Bit Size
32
Address Bus Width
32
Boundary Scan
YES
Low Power Mode
YES
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
Voltage - I/O
3.3V
Ethernet
10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Co-Processors/DSP
Communications; CPM
Height Seated (Max)
2.52mm
Length
25mm
RoHS Status
Non-RoHS Compliant

Description

MPC860TZQ50D4 Description
The manufacturer of this component is NXP USA Inc. It is a type of chip known as Embedded - Microprocessors, which falls under the Embedded - Microprocessors category. The packaging or casing of this chip is 357-BBGA and it is designed for surface mounting. The operating temperature range for this chip is 0°C to 95°C, as indicated by the TA code. The JESD-609 code for this chip is e0, indicating its compliance with industry standards. It has a total of 357 terminations, making it suitable for complex applications. The maximum reflow temperature for this chip is 30 seconds, as per JESD-30 code S-PBGA-B357. It has a speed of 50MHz and a bit size of 32, making it fast and efficient. The external data bus width for this chip is also 32, further indicating its high performance capabilities.

MPC860TZQ50D4 Features
4Kb Instruction Cache; MPC860P - 16Kb Instruction Cache 4Kb Data Cache; MPC860P - 8Kb Data Cache 8Kb Dual Port RAM Instruction and Data MMUs Up to 32-Bit Data Bus (Dynamic Bus Sizing for 8,16, and 32 Bits) 32 Address Lines Complete Static Design (040 MHz Operation)

MPC860TZQ50D4 Applications
Industrial Appliances Enterprise systems Enterprise machine Personal electronics Tablets

MPC860TZQ50D4 More Descriptions

MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 50MHz 357-Pin BGA Tray
PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C
IC MPU POWERQUICC 50MHZ 357PBGA
Microprocessors - MPU POWER QUICC
32-bit Communication Processors POWER QUICC
French Electronic Distributor since 1988
POWERQUICC 32 BIT POWER ARCHITEC
MPU, 32BIT, 50MHZ, BGA-357; Series:MPC8xx; Core Size:32bit; Program Memory Size:-; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V; Digital IC Case Style:BGA; No. of Pins:357; CPU Speed:50MHz; Embedded Interface Type:Ethernet, I2C, SPI, UART; Operating Temperature Min:0°C; Operating Temperature Max:95°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013)

Certification