NXP USA Inc. MPC860SRCZQ66D4
- Part Number:
- MPC860SRCZQ66D4
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3667545-MPC860SRCZQ66D4
- Description:
- IC MPU MPC8XX 66MHZ 357BGA
- Datasheet:
- MPC860SRCZQ66D4
NXP USA Inc. MPC860SRCZQ66D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860SRCZQ66D4.
- Factory Lead Time12 Weeks
- Package / Case357-BBGA
- Surface MountYES
- Operating Temperature-40°C~95°C TA
- PackagingTray
- Published1995
- SeriesMPC8xx
- JESD-609 Codee0
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations357
- ECCN Code3A991.A.2
- Terminal FinishTin/Lead (Sn/Pb)
- HTS Code8542.31.00.01
- SubcategoryMicroprocessors
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberMPC860
- JESD-30 CodeS-PBGA-B357
- Supply Voltage-Max (Vsup)3.465V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3.135V
- Speed66MHz
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
- Clock Frequency50MHz
- Bit Size32
- Address Bus Width32
- Boundary ScanYES
- Low Power ModeYES
- External Data Bus Width32
- FormatFIXED POINT
- Integrated CacheYES
- Voltage - I/O3.3V
- Ethernet10Mbps (4)
- Number of Cores/Bus Width1 Core 32-Bit
- Graphics AccelerationNo
- RAM ControllersDRAM
- Additional InterfacesHDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
- Co-Processors/DSPCommunications; CPM
- Height Seated (Max)2.52mm
- Length25mm
- RoHS StatusNon-RoHS Compliant
MPC860SRCZQ66D4 Overview
Packaging is an important aspect of electronic components, and for the MPC860 microprocessor, the Tray packaging is used. This type of packaging is commonly used for storing and transporting electronic components in a safe and organized manner. The JESD-609 Code for this microprocessor is e0, which is a standard code used for identifying the package type. The Terminal Form for the MPC860 is BALL, which refers to the shape of the terminals on the component. The Terminal Pitch, or the distance between the terminals, is 1.27mm. This microprocessor falls under the category of uPs/uCs/Peripheral ICs and is specifically classified as a MICROPROCESSOR with a RISC architecture. It has a Clock Frequency of 50MHz, which determines the speed at which it can process instructions. The MPC860 also has Boundary Scan capabilities, allowing for easier testing and debugging. The Voltage - I/O for this microprocessor is 3.3V, indicating the operating voltage for its input/output signals. It has 1 core with a 32-bit bus width, providing efficient data processing capabilities. Overall, the MPC860 is a highly functional microprocessor with advanced features and specifications.
MPC860SRCZQ66D4 Features
32-Bit Structure
MPC860SRCZQ66D4 Applications
There are a lot of NXP USA Inc. MPC860SRCZQ66D4 Microprocessor applications.
Fire detection & safety devices
Industrial instrumentation devices
Mobile computers
DDC control
Robots
Petrochemical
Home appliances
Sonography (Ultrasound imaging)
Automatic staplers
Information appliances (networking of household appliances)
Packaging is an important aspect of electronic components, and for the MPC860 microprocessor, the Tray packaging is used. This type of packaging is commonly used for storing and transporting electronic components in a safe and organized manner. The JESD-609 Code for this microprocessor is e0, which is a standard code used for identifying the package type. The Terminal Form for the MPC860 is BALL, which refers to the shape of the terminals on the component. The Terminal Pitch, or the distance between the terminals, is 1.27mm. This microprocessor falls under the category of uPs/uCs/Peripheral ICs and is specifically classified as a MICROPROCESSOR with a RISC architecture. It has a Clock Frequency of 50MHz, which determines the speed at which it can process instructions. The MPC860 also has Boundary Scan capabilities, allowing for easier testing and debugging. The Voltage - I/O for this microprocessor is 3.3V, indicating the operating voltage for its input/output signals. It has 1 core with a 32-bit bus width, providing efficient data processing capabilities. Overall, the MPC860 is a highly functional microprocessor with advanced features and specifications.
MPC860SRCZQ66D4 Features
32-Bit Structure
MPC860SRCZQ66D4 Applications
There are a lot of NXP USA Inc. MPC860SRCZQ66D4 Microprocessor applications.
Fire detection & safety devices
Industrial instrumentation devices
Mobile computers
DDC control
Robots
Petrochemical
Home appliances
Sonography (Ultrasound imaging)
Automatic staplers
Information appliances (networking of household appliances)
MPC860SRCZQ66D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 66MHz 357-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 95C
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 95C
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
15 March 2024
ULN2003 Alternatives, Characteristics, Working Principle and Application
Ⅰ. ULN2003 overviewⅡ. What are the characteristics of ULN2003?Ⅲ. Pin diagram and functions of ULN2003Ⅳ. Working principle and function of ULN2003Ⅴ. ULN2003 drive circuit diagramⅥ. Where is ULN2003... -
15 March 2024
Detailed Explanation of 24C02 EEPROM Memory Chip
Ⅰ. Overview of 24C02Ⅱ. Functions of 24C02Ⅲ. Basic operations of 24C02Ⅳ. Application of 24C02Ⅴ. 24C02 pinoutⅥ. How to protect the data of 24C02?Ⅶ. How to use 24C02?EEPROM refers... -
18 March 2024
LM324N Internal Structure, Working Principle and LM324 vs LM324N
Ⅰ. Overview of LM324NⅡ. Internal structure and working principle of LM324NⅢ. Typical performance characteristics of LM324NⅣ. How to configure the power supply for LM324N?Ⅴ. Pin description of LM324NⅥ.... -
18 March 2024
TDA7377 Audio Power Amplifier Alternatives, Application and Other Details
Ⅰ. Overview of TDA7377Ⅱ. Performance evaluation of TDA7377Ⅲ. Internal circuit diagram of TDA7377Ⅳ. Application of TDA7377Ⅴ. PCB-layout grounding of TDA7377Ⅵ. TDA7377 power amplifier chip parametersⅦ. How to ensure...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.