MPC860SRCZQ66D4

NXP USA Inc. MPC860SRCZQ66D4

Part Number:
MPC860SRCZQ66D4
Manufacturer:
NXP USA Inc.
Ventron No:
3667545-MPC860SRCZQ66D4
Description:
IC MPU MPC8XX 66MHZ 357BGA
ECAD Model:
Datasheet:
MPC860SRCZQ66D4

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Specifications
NXP USA Inc. MPC860SRCZQ66D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860SRCZQ66D4.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    66MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (4)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC860SRCZQ66D4 Overview
Packaging is an important aspect of electronic components, and for the MPC860 microprocessor, the Tray packaging is used. This type of packaging is commonly used for storing and transporting electronic components in a safe and organized manner. The JESD-609 Code for this microprocessor is e0, which is a standard code used for identifying the package type. The Terminal Form for the MPC860 is BALL, which refers to the shape of the terminals on the component. The Terminal Pitch, or the distance between the terminals, is 1.27mm. This microprocessor falls under the category of uPs/uCs/Peripheral ICs and is specifically classified as a MICROPROCESSOR with a RISC architecture. It has a Clock Frequency of 50MHz, which determines the speed at which it can process instructions. The MPC860 also has Boundary Scan capabilities, allowing for easier testing and debugging. The Voltage - I/O for this microprocessor is 3.3V, indicating the operating voltage for its input/output signals. It has 1 core with a 32-bit bus width, providing efficient data processing capabilities. Overall, the MPC860 is a highly functional microprocessor with advanced features and specifications.

MPC860SRCZQ66D4 Features
32-Bit Structure

MPC860SRCZQ66D4 Applications
There are a lot of NXP USA Inc. MPC860SRCZQ66D4 Microprocessor applications.

Fire detection & safety devices
Industrial instrumentation devices
Mobile computers
DDC control
Robots
Petrochemical
Home appliances
Sonography (Ultrasound imaging)
Automatic staplers
Information appliances (networking of household appliances)
MPC860SRCZQ66D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 66MHz 357-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 95C
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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