MPC860SRCVR66D4

NXP USA Inc. MPC860SRCVR66D4

Part Number:
MPC860SRCVR66D4
Manufacturer:
NXP USA Inc.
Ventron No:
3161492-MPC860SRCVR66D4
Description:
IC MPU MPC8XX 66MHZ 357BGA
ECAD Model:
Datasheet:
MPC860SRCVR66D4

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Specifications
NXP USA Inc. MPC860SRCVR66D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860SRCVR66D4.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e1
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    TIN SILVER COPPER
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    66MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (4)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    ROHS3 Compliant
Description
MPC860SRCVR66D4 Overview
This particular component is manufactured by NXP USA Inc. and falls into the category of Embedded - Microprocessors. It is a chip designed specifically for use in embedded systems and belongs to the MPC8xx series. The package or case of this chip is 357-BBGA and it has a Moisture Sensitivity Level (MSL) of 3, meaning it can be exposed to moisture for up to 168 hours without any negative effects. The terminal position of the chip is located at the bottom. It requires a supply voltage of 3.3V and is classified as a MICROPROCESSOR, RISC type chip, commonly used in microcontrollers and peripheral devices. This chip also has a low power mode feature. Its external data bus has a width of 32 bits and it measures 25mm in length. It is also compliant with the Restriction of Hazardous Substances Directive (RoHS), ensuring it meets environmental safety standards.

MPC860SRCVR66D4 Features
32-Bit Structure

MPC860SRCVR66D4 Applications
There are a lot of NXP USA Inc. MPC860SRCVR66D4 Microprocessor applications.

Consumer electronics products
Food and beverage
Communication-bluetooth, Wi-Fi, radio
Speed meter
Calculators
Industrial instrumentation devices
Air fryers
Heater/Fan
Paper shredders
Copiers
MPC860SRCVR66D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 66MHz 357-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
POWERQUICC RISC MICROPROCESSOR,
32-bit Communication Processors POWER QUICC-NO LEAD
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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