MPC860PZQ80D4

NXP USA Inc. MPC860PZQ80D4

Part Number:
MPC860PZQ80D4
Manufacturer:
NXP USA Inc.
Ventron No:
3160196-MPC860PZQ80D4
Description:
IC MPU MPC8XX 80MHZ 357BGA
ECAD Model:
Datasheet:
MPC860PZQ80D4

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Specifications
NXP USA Inc. MPC860PZQ80D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860PZQ80D4.
  • Factory Lead Time
    8 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    80MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (4), 10/100Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC860PZQ80D4 Description
NXP USA Inc. offers a high-quality Embedded - Microprocessors chip that falls under the Embedded - Microprocessors category. This chip features a YES for Surface Mount and a Moisture Sensitivity Level (MSL) of 3 (168 Hours). The Terminal Position is located at the BOTTOM with a Terminal Pitch of 1.27mm and a maximum Reflow Temperature of 30 seconds. It is classified under the JESD-30 Code S-PBGA-B357 and has a maximum Supply Voltage (Vsup) of 3.465V. With a speed of 80MHz and a Bit Size of 32, this chip offers a reliable and efficient performance in a FIXED POINT format.

MPC860PZQ80D4 Features
4Kb Instruction Cache; MPC860P - 16Kb Instruction Cache 4Kb Data Cache; MPC860P - 8Kb Data Cache 8Kb Dual Port RAM Instruction and Data MMUs Up to 32-Bit Data Bus (Dynamic Bus Sizing for 8,16, and 32 Bits) 32 Address Lines

MPC860PZQ80D4 Applications
Automotive  Advanced driver assistance systems (ADAS)  Industrial  Test & Measurement  Enterprise systems  Enterprise machine
MPC860PZQ80D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 80MHz 357-Pin BGA Tray
RISC Microprocessor, 32-Bit, 80MHz, CMOS, PBGA357
PowerQUICC, 32 Bit Power Architecture SoC, 80MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C
MPU, 32BIT, 80MHZ, BGA-357; Series:PowerQUICC I; Core Size:32bit; Program Memory Size:-; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V; Digital IC Case Style:BGA; No. of Pins:357; CPU Speed:80MHz; Embedded Interface Type:I2C, SPI; Operating Temperature Min:0°C; Operating Temperature Max:95°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013)
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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