MPC860PZQ66D4

NXP USA Inc. MPC860PZQ66D4

Part Number:
MPC860PZQ66D4
Manufacturer:
NXP USA Inc.
Ventron No:
3827486-MPC860PZQ66D4
Description:
IC MPU MPC8XX 66MHZ 357BGA
ECAD Model:
Datasheet:
MPC860PZQ66D4

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Specifications
NXP USA Inc. MPC860PZQ66D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860PZQ66D4.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    66MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (4), 10/100Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC860PZQ66D4 Overview
This product features a wide operating temperature range of 0°C to 95°C, making it suitable for use in various environmental conditions. It is packaged in trays for efficient handling and storage. The terminal finish is composed of tin and lead (Sn/Pb), providing reliable electrical connections. With a minimum supply voltage of 3.135V, this product offers stable and consistent performance. It has a speed of 66MHz and a clock frequency of 50MHz, ensuring efficient data processing. The address bus width is 32, allowing for a large amount of data to be transferred. Additionally, this product includes various interfaces such as HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, and UART/USART, providing versatile connectivity options.

MPC860PZQ66D4 Features
32-Bit Structure

MPC860PZQ66D4 Applications
There are a lot of NXP USA Inc. MPC860PZQ66D4 Microprocessor applications.

Virtual reality VR robots
Food and beverage
Day to day life field
Computed Tomography (CT scan)
Dryers
Instrument control
Heart rate monitors
Entertainment-radios, CD players, televisions
Industrial instrumentation devices
Hearing aids
MPC860PZQ66D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 66MHz 357-Pin BGA Tray
FIXED POINT MICROPROCESSOR RISC 1Core 32-Bit BALL IC Microprocessor 0C~95C TA 25mm 3.135V 50MHz
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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