NXP USA Inc. MPC860PZQ50D4
- Part Number:
- MPC860PZQ50D4
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3160220-MPC860PZQ50D4
- Description:
- IC MPU MPC8XX 50MHZ 357BGA
- Datasheet:
- MPC860PZQ50D4
NXP USA Inc. MPC860PZQ50D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860PZQ50D4.
- Factory Lead Time12 Weeks
- Package / Case357-BBGA
- Surface MountYES
- Operating Temperature0°C~95°C TA
- PackagingTray
- Published1995
- SeriesMPC8xx
- JESD-609 Codee0
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations357
- ECCN Code3A991.A.2
- Terminal FinishTin/Lead (Sn/Pb)
- HTS Code8542.31.00.01
- SubcategoryMicroprocessors
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberMPC860
- JESD-30 CodeS-PBGA-B357
- Supply Voltage-Max (Vsup)3.465V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3.135V
- Speed50MHz
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
- Clock Frequency50MHz
- Bit Size32
- Address Bus Width32
- Boundary ScanYES
- Low Power ModeYES
- External Data Bus Width32
- FormatFIXED POINT
- Integrated CacheYES
- Voltage - I/O3.3V
- Ethernet10Mbps (4), 10/100Mbps (1)
- Number of Cores/Bus Width1 Core 32-Bit
- Graphics AccelerationNo
- RAM ControllersDRAM
- Additional InterfacesHDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
- Co-Processors/DSPCommunications; CPM
- Height Seated (Max)2.52mm
- Length25mm
- RoHS StatusNon-RoHS Compliant
MPC860PZQ50D4 Overview
The ECCN Code for this particular technology is 3A991.A.2, indicating that it falls under the category of "Information Security Systems, Equipment, and Components." The technology used is CMOS, which stands for Complementary Metal-Oxide-Semiconductor, a type of integrated circuit design that allows for low power consumption and high speeds. The terminal position for this technology is at the bottom, meaning that it is designed to be mounted on the underside of a circuit board. The maximum reflow temperature for this technology is 30 seconds, ensuring that it can withstand high temperatures during the manufacturing process. With a supply voltage of 3.465V and a bit size of 32, this technology is efficient and powerful. It also has a low power mode, making it energy-efficient. The RAM controllers used are DRAM, providing fast and reliable access to data. With a maximum seated height of 2.52mm, this technology is compact and can easily fit into electronic devices. However, it is important to note that it is non-RoHS compliant, meaning it contains substances that are not environmentally friendly.
MPC860PZQ50D4 Features
32-Bit Structure
MPC860PZQ50D4 Applications
There are a lot of NXP USA Inc. MPC860PZQ50D4 Microprocessor applications.
Fax machines
Digital set-top boxes
Virtual reality VR robots
Fax machines
DVD\DV\MP3 players
Food and beverage
Industrial instrumentation devices
Temperature sensing and controlling devices
Aerospace navigation systems
Paper shredders
The ECCN Code for this particular technology is 3A991.A.2, indicating that it falls under the category of "Information Security Systems, Equipment, and Components." The technology used is CMOS, which stands for Complementary Metal-Oxide-Semiconductor, a type of integrated circuit design that allows for low power consumption and high speeds. The terminal position for this technology is at the bottom, meaning that it is designed to be mounted on the underside of a circuit board. The maximum reflow temperature for this technology is 30 seconds, ensuring that it can withstand high temperatures during the manufacturing process. With a supply voltage of 3.465V and a bit size of 32, this technology is efficient and powerful. It also has a low power mode, making it energy-efficient. The RAM controllers used are DRAM, providing fast and reliable access to data. With a maximum seated height of 2.52mm, this technology is compact and can easily fit into electronic devices. However, it is important to note that it is non-RoHS compliant, meaning it contains substances that are not environmentally friendly.
MPC860PZQ50D4 Features
32-Bit Structure
MPC860PZQ50D4 Applications
There are a lot of NXP USA Inc. MPC860PZQ50D4 Microprocessor applications.
Fax machines
Digital set-top boxes
Virtual reality VR robots
Fax machines
DVD\DV\MP3 players
Food and beverage
Industrial instrumentation devices
Temperature sensing and controlling devices
Aerospace navigation systems
Paper shredders
MPC860PZQ50D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 50MHz 357-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C
IC, 32-BIT MPU, 50 MHz, 357-PBGA; Series:PowerQUICC I; Core Size:32 bit; Program Memory Size:8 KB; CPU Speed:50MHz; Digital IC Case Style:PBGA; No. of Pins:357; Supply Voltage Range:3.3V; Operating Temperature Range:-40°C to 95°C ;RoHS Compliant: No
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C
IC, 32-BIT MPU, 50 MHz, 357-PBGA; Series:PowerQUICC I; Core Size:32 bit; Program Memory Size:8 KB; CPU Speed:50MHz; Digital IC Case Style:PBGA; No. of Pins:357; Supply Voltage Range:3.3V; Operating Temperature Range:-40°C to 95°C ;RoHS Compliant: No
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