NXP USA Inc. MPC860ENZQ80D4
- Part Number:
- MPC860ENZQ80D4
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3161531-MPC860ENZQ80D4
- Description:
- IC MPU MPC8XX 80MHZ 357BGA
- Datasheet:
- MPC860ENZQ80D4
NXP USA Inc. MPC860ENZQ80D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860ENZQ80D4.
- Factory Lead Time8 Weeks
- Package / Case357-BBGA
- Surface MountYES
- Operating Temperature0°C~95°C TA
- PackagingTray
- Published1995
- SeriesMPC8xx
- JESD-609 Codee0
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations357
- ECCN Code3A991.A.2
- Terminal FinishTin/Lead (Sn/Pb)
- HTS Code8542.31.00.01
- SubcategoryMicroprocessors
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberMPC860
- JESD-30 CodeS-PBGA-B357
- Supply Voltage-Max (Vsup)3.465V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3.135V
- Speed80MHz
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
- Clock Frequency50MHz
- Bit Size32
- Address Bus Width32
- Boundary ScanYES
- Low Power ModeYES
- External Data Bus Width32
- FormatFIXED POINT
- Integrated CacheYES
- Voltage - I/O3.3V
- Ethernet10Mbps (4)
- Number of Cores/Bus Width1 Core 32-Bit
- Graphics AccelerationNo
- RAM ControllersDRAM
- Additional InterfacesI2C, IrDA, PCMCIA, SPI, TDM, UART/USART
- Co-Processors/DSPCommunications; CPM
- Height Seated (Max)2.52mm
- Length25mm
- RoHS StatusNon-RoHS Compliant
MPC860ENZQ80D4 Overview
From a technical standpoint, the NXP USA Inc. brand is highly regarded in the electronics industry, particularly in the field of Embedded - Microprocessors. This specific chip is designed to meet the demands of complex and advanced embedded systems, making it a valuable component for various applications. As indicated by its Part Status of Not For New Designs, this chip has been in the market for some time and has proven its reliability and efficiency, making it a trusted choice for engineers and manufacturers alike. One of the key parameters to consider when evaluating a chip is its number of terminations, which in this case is 357. This high number allows for a greater number of connections, making it suitable for intricate circuitry and ensuring smooth and seamless operation. Additionally, the terminal form of BALL and terminal pitch of 1.27mm further enhance the chip's connectivity and compatibility with other components. In terms of performance, the NXP USA Inc. chip boasts a reflow temperature-max of 30 seconds, indicating its ability to withstand high temperatures and maintain its functionality. This is crucial in applications where the chip may be exposed to extreme heat, ensuring its longevity and reliability. Furthermore, the external data bus width of 32 and format of FIXED POINT showcase the chip's capabilities in handling large amounts of data and processing it efficiently. Another noteworthy feature of this chip is its Ethernet compatibility, specifically with a speed of 10Mbps (4). This makes it suitable for networking applications, allowing for fast and reliable data transfer. Additionally, the chip's 1 Core 32-Bit configuration further highlights its processing power, making it a versatile choice for various tasks. In terms of physical specifications, the NXP USA Inc. chip has a height seated (max) of 2.52mm. This compact size makes it suitable for use in space-constrained applications, without compromising on its performance. This parameter is particularly important for devices such as mobile phones and tablets, where size and efficiency are key factors. In conclusion, the NXP USA Inc. chip offers a comprehensive range of features and parameters that make it a top choice for embedded systems. Its proven track record, high number of terminations, impressive performance, and compact size make it a valuable addition to any electronic design.
MPC860ENZQ80D4 Features
32-Bit Structure
MPC860ENZQ80D4 Applications
There are a lot of NXP USA Inc. MPC860ENZQ80D4 Microprocessor applications.
Auto-breaking system
Hearing aids
Heater/Fan
Toasters
Network application field
Missile control
Nintendo
DDC control
Oscilloscopes
Agriculture, transportation field
From a technical standpoint, the NXP USA Inc. brand is highly regarded in the electronics industry, particularly in the field of Embedded - Microprocessors. This specific chip is designed to meet the demands of complex and advanced embedded systems, making it a valuable component for various applications. As indicated by its Part Status of Not For New Designs, this chip has been in the market for some time and has proven its reliability and efficiency, making it a trusted choice for engineers and manufacturers alike. One of the key parameters to consider when evaluating a chip is its number of terminations, which in this case is 357. This high number allows for a greater number of connections, making it suitable for intricate circuitry and ensuring smooth and seamless operation. Additionally, the terminal form of BALL and terminal pitch of 1.27mm further enhance the chip's connectivity and compatibility with other components. In terms of performance, the NXP USA Inc. chip boasts a reflow temperature-max of 30 seconds, indicating its ability to withstand high temperatures and maintain its functionality. This is crucial in applications where the chip may be exposed to extreme heat, ensuring its longevity and reliability. Furthermore, the external data bus width of 32 and format of FIXED POINT showcase the chip's capabilities in handling large amounts of data and processing it efficiently. Another noteworthy feature of this chip is its Ethernet compatibility, specifically with a speed of 10Mbps (4). This makes it suitable for networking applications, allowing for fast and reliable data transfer. Additionally, the chip's 1 Core 32-Bit configuration further highlights its processing power, making it a versatile choice for various tasks. In terms of physical specifications, the NXP USA Inc. chip has a height seated (max) of 2.52mm. This compact size makes it suitable for use in space-constrained applications, without compromising on its performance. This parameter is particularly important for devices such as mobile phones and tablets, where size and efficiency are key factors. In conclusion, the NXP USA Inc. chip offers a comprehensive range of features and parameters that make it a top choice for embedded systems. Its proven track record, high number of terminations, impressive performance, and compact size make it a valuable addition to any electronic design.
MPC860ENZQ80D4 Features
32-Bit Structure
MPC860ENZQ80D4 Applications
There are a lot of NXP USA Inc. MPC860ENZQ80D4 Microprocessor applications.
Auto-breaking system
Hearing aids
Heater/Fan
Toasters
Network application field
Missile control
Nintendo
DDC control
Oscilloscopes
Agriculture, transportation field
MPC860ENZQ80D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 80MHz 357-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture SoC, 80MHz, CPM, ENET, PCMCIA, 0 to 95C
Microprocessors - MPU POWER QUICC
32-bit Communication Processors POWER QUICC
French Electronic Distributor since 1988
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture SoC, 80MHz, CPM, ENET, PCMCIA, 0 to 95C
Microprocessors - MPU POWER QUICC
32-bit Communication Processors POWER QUICC
French Electronic Distributor since 1988
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
29 January 2024
TQP3M9028 RF Amplifier Alternatives, Market Trend, Applications and Other Details
Ⅰ. TQP3M9028 descriptionⅡ. Manufacturer of TQP3M9028Ⅲ. Specifications of TQP3M9028Ⅳ. Market trend of TQP3M9028Ⅴ. How to choose TQP3M9028?Ⅵ. Absolute maximum ratings of TQP3M9028Ⅶ. Where is TQP3M9028 used?TQP3M9028 is a... -
30 January 2024
AD7606BSTZ Converter Technical Parameters, Characteristics, Working Principle and Package
Ⅰ. Overview of AD7606BSTZⅡ. Technical parameters of AD7606BSTZⅢ. Characteristics of AD7606BSTZⅣ. Absolute maximum ratings of AD7606BSTZⅤ. How does AD7606BSTZ work?Ⅵ. Package of AD7606BSTZⅦ. What are the applications of... -
30 January 2024
LSM6DS3TR Alternatives, Features, Specifications, LSM6DS3TR vs LSM6DS3 and Applications
Ⅰ. Introduction to LSM6DS3TRⅡ. What are the features of LSM6DS3TR?Ⅲ. Absolute maximum ratings of LSM6DS3TRⅣ. Specifications of LSM6DS3TRⅤ. What are the advantages and disadvantages of LSM6DS3TR?Ⅵ. What is... -
31 January 2024
ISO1050DUBR Characteristics, Application Fields, Layout Guidelines and More
Ⅰ. What is a CAN transceiver?Ⅱ. Overview of ISO1050DUBRⅢ. Technical parameters of ISO1050DUBRⅣ. Characteristics of ISO1050DUBRⅤ. ISO1050DUBR symbol, footprint and pin configurationⅥ. Application fields of ISO1050DUBRⅦ. Layout guidelines...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.