MPC860ENZQ80D4

NXP USA Inc. MPC860ENZQ80D4

Part Number:
MPC860ENZQ80D4
Manufacturer:
NXP USA Inc.
Ventron No:
3161531-MPC860ENZQ80D4
Description:
IC MPU MPC8XX 80MHZ 357BGA
ECAD Model:
Datasheet:
MPC860ENZQ80D4

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Specifications
NXP USA Inc. MPC860ENZQ80D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860ENZQ80D4.
  • Factory Lead Time
    8 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    80MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (4)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC860ENZQ80D4 Overview
From a technical standpoint, the NXP USA Inc. brand is highly regarded in the electronics industry, particularly in the field of Embedded - Microprocessors. This specific chip is designed to meet the demands of complex and advanced embedded systems, making it a valuable component for various applications. As indicated by its Part Status of Not For New Designs, this chip has been in the market for some time and has proven its reliability and efficiency, making it a trusted choice for engineers and manufacturers alike. One of the key parameters to consider when evaluating a chip is its number of terminations, which in this case is 357. This high number allows for a greater number of connections, making it suitable for intricate circuitry and ensuring smooth and seamless operation. Additionally, the terminal form of BALL and terminal pitch of 1.27mm further enhance the chip's connectivity and compatibility with other components. In terms of performance, the NXP USA Inc. chip boasts a reflow temperature-max of 30 seconds, indicating its ability to withstand high temperatures and maintain its functionality. This is crucial in applications where the chip may be exposed to extreme heat, ensuring its longevity and reliability. Furthermore, the external data bus width of 32 and format of FIXED POINT showcase the chip's capabilities in handling large amounts of data and processing it efficiently. Another noteworthy feature of this chip is its Ethernet compatibility, specifically with a speed of 10Mbps (4). This makes it suitable for networking applications, allowing for fast and reliable data transfer. Additionally, the chip's 1 Core 32-Bit configuration further highlights its processing power, making it a versatile choice for various tasks. In terms of physical specifications, the NXP USA Inc. chip has a height seated (max) of 2.52mm. This compact size makes it suitable for use in space-constrained applications, without compromising on its performance. This parameter is particularly important for devices such as mobile phones and tablets, where size and efficiency are key factors. In conclusion, the NXP USA Inc. chip offers a comprehensive range of features and parameters that make it a top choice for embedded systems. Its proven track record, high number of terminations, impressive performance, and compact size make it a valuable addition to any electronic design.

MPC860ENZQ80D4 Features
32-Bit Structure

MPC860ENZQ80D4 Applications
There are a lot of NXP USA Inc. MPC860ENZQ80D4 Microprocessor applications.

Auto-breaking system
Hearing aids
Heater/Fan
Toasters
Network application field
Missile control
Nintendo
DDC control
Oscilloscopes
Agriculture, transportation field
MPC860ENZQ80D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 80MHz 357-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture SoC, 80MHz, CPM, ENET, PCMCIA, 0 to 95C
Microprocessors - MPU POWER QUICC
32-bit Communication Processors POWER QUICC
French Electronic Distributor since 1988
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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