MPC860ENVR66D4

NXP USA Inc. MPC860ENVR66D4

Part Number:
MPC860ENVR66D4
Manufacturer:
NXP USA Inc.
Ventron No:
3667500-MPC860ENVR66D4
Description:
IC MPU MPC8XX 66MHZ 357BGA
ECAD Model:
Datasheet:
MPC860ENVR66D4

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Specifications
NXP USA Inc. MPC860ENVR66D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860ENVR66D4.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e1
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    TIN SILVER COPPER
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    66MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (4)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    ROHS3 Compliant
Description
MPC860ENVR66D4 Overview
The manufacturer of this component is NXP USA Inc. It is a type of Embedded - Microprocessors chip, which falls under the Embedded - Microprocessors category. Its current status is Not For New Designs, meaning it is not recommended for use in new designs. The Moisture Sensitivity Level (MSL) is 3, indicating that it can withstand exposure to moisture for up to 168 hours. The Terminal Finish is TIN SILVER COPPER, which is the coating on the component's terminals. The Base Part Number is MPC860, which identifies the specific model of the chip. The JESD-30 Code is S-PBGA-B357, which is a standardized code used to describe the package type and dimensions of the chip. The maximum supply voltage (Vsup) for this chip is 3.465V. It has a clock frequency of 50MHz, meaning it can process instructions at a rate of 50 million per second. The Bit Size is 32, indicating that it is a 32-bit chip. The Address Bus Width is also 32, meaning it can access up to 32 bits of memory at a time. This chip also has Boundary Scan capabilities, allowing for testing and debugging of the chip's internal connections.

MPC860ENVR66D4 Features
32-Bit Structure

MPC860ENVR66D4 Applications
There are a lot of NXP USA Inc. MPC860ENVR66D4 Microprocessor applications.

Firewalls
Robots
Keyboards
Telephone sets
Coffee machines
ECG machine
Pacemakers (used to control abnormal heart rhythm)
Measuring revolving objects
Microwave ovens
Robotic prosthetic limbs
MPC860ENVR66D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 66MHz 357-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, PCMCIA, 0 to 95C
32-bit Communication Processors POWER QUICC-NO LEAD
IC REG LINEAR 12V 50MA SOT89-5
POWERQUICC 32 BIT POWER ARCHITEC
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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