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MPC860DTZQ80D4

NXP USA Inc. MPC860DTZQ80D4

Part Number:
MPC860DTZQ80D4
Manufacturer:
NXP USA Inc.
Ventron No:
3667541-MPC860DTZQ80D4
Description:
IC MPU MPC8XX 80MHZ 357BGA
ECAD Model:
Datasheet:
MPC860DTZQ80D4

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Specifications
NXP USA Inc. MPC860DTZQ80D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860DTZQ80D4.
  • Factory Lead Time
    8 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    80MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (2), 10/100Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC860DTZQ80D4 Overview
This particular component is manufactured by NXP USA Inc. and falls under the category of Embedded - Microprocessors chips. It is designed to be mounted on the surface of a circuit board and has a temperature range of 0°C to 95°C. It has a Moisture Sensitivity Level of 3, meaning it can withstand exposure to moisture for up to 168 hours. The terminal finish is made of Tin/Lead (Sn/Pb) and the technology used is CMOS. The terminal form is in the shape of a ball. The supply voltage for this chip is 3.3V and its base part number is MPC860. The minimum supply voltage required for this chip to function is 3.135V and it has a speed of 80MHz.

MPC860DTZQ80D4 Features
32-Bit Structure

MPC860DTZQ80D4 Applications
There are a lot of NXP USA Inc. MPC860DTZQ80D4 Microprocessor applications.

Washing machine
Process control devices
Fax machines
Accu-check
Microwave ovens
Smartphone
Communication-bluetooth, Wi-Fi, radio
Digital set-top boxes
Binding machines
X-ray
MPC860DTZQ80D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 80MHz 357-Pin BGA Tray
FIXED POINT MICROPROCESSOR RISC 1Core 32-Bit BALL IC Microprocessor 0C~95C TA 25mm 3.135V 50MHz
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture SoC, 80MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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