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MPC860DTCZQ50D4

NXP USA Inc. MPC860DTCZQ50D4

Part Number:
MPC860DTCZQ50D4
Manufacturer:
NXP USA Inc.
Ventron No:
3161416-MPC860DTCZQ50D4
Description:
IC MPU MPC8XX 50MHZ 357BGA
ECAD Model:
Datasheet:
MPC860DTCZQ50D4

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Specifications
NXP USA Inc. MPC860DTCZQ50D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860DTCZQ50D4.
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    50MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (2), 10/100Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC860DTCZQ50D4 Overview
The surface mount technology used in electronic components has been classified as YES according to the JESD-609 Code, with an e0 rating. This means that the components are suitable for use in surface mount assemblies. The peak reflow temperature for these components is 245 degrees Celsius. The supply voltage for these components is 3.3V, and the base part number is MPC860. These components have a clock frequency of 50MHz and a voltage of 3.3V for input/output. The RAM controllers for these components are DRAM, and the co-processors/DSP are specifically designed for communications, known as CPM. It is important to note that these components are currently classified as Non-RoHS Compliant.

MPC860DTCZQ50D4 Features
32-Bit Structure

MPC860DTCZQ50D4 Applications
There are a lot of NXP USA Inc. MPC860DTCZQ50D4 Microprocessor applications.

Printers
Firewalls
Light sensing & controlling devices
Vacuum cleaners
Robots
Accu-check
Process control devices
Security systems
Industrial instrumentation devices
Day to day life field
MPC860DTCZQ50D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 50MHz 357-Pin BGA Tray
Ic,microprocessor,32-Bit,cmos,bga,357Pin,plastic Rohs Compliant: No |Nxp MPC860DTCZQ50D4
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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