NXP USA Inc. MPC860DTCVR50D4

MPC860DTCVR50D4 Overview
The package or case of the electronic device is 357-BBGA, which refers to the Ball Grid Array with 357 terminations. This package is designed to withstand extreme operating temperatures ranging from -40°C to 95°C TA, making it suitable for use in various environments. It also complies with the JESD-609 Code e1, ensuring its reliability and performance. The package is classified under HTS Code 8542.31.00.01, indicating its use in electronic integrated circuits. The terminal form of this package is BALL, providing a secure and efficient connection. The supply voltage-min (Vsup) required for this package is 3.135V, ensuring stable and consistent power supply. Although this package does not support graphics acceleration, it offers a wide range of additional interfaces such as HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, and UART/USART. Lastly, this package is ROHS3 compliant, indicating its compliance with the Restriction of Hazardous Substances Directive.

MPC860DTCVR50D4 Features
32-Bit Structure

MPC860DTCVR50D4 Applications
There are a lot of NXP USA Inc. MPC860DTCVR50D4 Microprocessor applications.

Data acquisition and control
Toasters
Wastewater treatment
Mobile computers
Washing machine
Electronic jamming systems
Computer/laptop
Measurement and control field
Computed Tomography (CT scan)
Gas monitoring systems