MPC855TVR66D4

NXP USA Inc. MPC855TVR66D4

Part Number:
MPC855TVR66D4
Manufacturer:
NXP USA Inc.
Ventron No:
3161318-MPC855TVR66D4
Description:
IC MPU MPC8XX 66MHZ 357BGA
ECAD Model:
Datasheet:
MPC855TVR66D4

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Specifications
NXP USA Inc. MPC855TVR66D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC855TVR66D4.
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TA
  • Packaging
    Tray
  • Published
    2002
  • Series
    MPC8xx
  • JESD-609 Code
    e1
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC855
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    66MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (1), 10/100Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    ROHS3 Compliant
Description
MPC855TVR66D4 Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is achieved using advanced packaging method Tray. The CPU has 1 Core 32-Bit cores/Bus width. Identify the operating temperature around 0°C~95°C TA. MPC8xx is its series number. DRAM RAM controllers are used by this CPU. This microprocessor has HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces to serve you better. This CPU runs I/O at 3.3V. This is a MICROPROCESSOR, RISC for the uPs/uCs/Peripheral ICs type. Using MPC855 will help you find variants of the cpu microprocessor. Total terminations are 357. When the voltage supply is 3.3V, the cpu microprocessor should be powered on and run. In terms of architecture, it is a 32-Bit system. The supply voltage should not exceed 3.465V. A typical Microprocessors embedded microprocessor. Its external data bus width is 32. 50MHz is the clock frequency of the embedded microprocessor. As specified in datasheets, the embedded microprocessor requires 3.3V power supplies.

MPC855TVR66D4 Features
32-Bit Structure

MPC855TVR66D4 Applications
There are a lot of NXP USA Inc. MPC855TVR66D4 Microprocessor applications.

Monitoring-temperature level, oil level, speed, distance, acceleration
Medical instruments chromatographs
Smart highways (navigation, traffic control, information monitoring and car service)
Food and beverage
Nintendo
Ipad
Computed Tomography (CT scan)
Leakage current tester
Ipod
Computers and laptops-video calling, email, blogging
MPC855TVR66D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 66MHz 357-Pin BGA Tray
PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C
IC, 32-BIT MPU, 66 MHz, 357-PBGA; Series:PowerQUICC I; Core Size:32 bit; CPU Speed:66MHz; Digital IC Case Style:PBGA; No. of Pins:357; Supply Voltage Range:3V to 3.6V; Operating Temperature Range:0°C to 95°C ;RoHS Compliant: Yes
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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