NXP USA Inc. MPC8545EPXANGD
- Part Number:
- MPC8545EPXANGD
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3670345-MPC8545EPXANGD
- Description:
- IC MPU MPC85XX 800MHZ 783FCBGA
- Datasheet:
- MPC8545EPXANGD
NXP USA Inc. MPC8545EPXANGD technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8545EPXANGD.
- Package / Case783-BBGA, FCBGA
- Operating Temperature0°C~105°C TA
- PackagingTray
- Published2007
- SeriesMPC85xx
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Base Part NumberMPC8545
- Speed800MHz
- Core ProcessorPowerPC e500
- Voltage - I/O1.8V 2.5V 3.3V
- Ethernet10/100/1000Mbps (4)
- Number of Cores/Bus Width1 Core 32-Bit
- Graphics AccelerationNo
- RAM ControllersDDR, DDR2, SDRAM
- Additional InterfacesDUART, I2C, PCI, RapidIO
- Co-Processors/DSPSignal Processing; SPE, Security; SEC
- Security FeaturesCryptography, Random Number Generator
- RoHS StatusNon-RoHS Compliant
MPC8545EPXANGD Overview
The manufacturer of this component is NXP USA Inc., a company specializing in the production of Embedded - Microprocessors chips. This specific chip falls under the category of Embedded - Microprocessors. It is available in a 783-BBGA or FCBGA package/case and has an operating temperature range of 0°C to 105°C. The series of this chip is MPC85xx and it is currently considered obsolete. Its Moisture Sensitivity Level (MSL) is 3, meaning it can be exposed to moisture for up to 168 hours. The core processor of this chip is PowerPC e500, and it also features additional interfaces such as DUART, I2C, PCI, and RapidIO. It has co-processors/DSPs for signal processing and security, including cryptography and a random number generator. This chip is currently not compliant with RoHS standards.
MPC8545EPXANGD Features
PowerPC e500 Core
MPC8545EPXANGD Applications
There are a lot of NXP USA Inc. MPC8545EPXANGD Microprocessor applications.
Smartphone
Light sensing & controlling devices
Fire detection & safety devices
Communication-bluetooth, Wi-Fi, radio
Day to day life field
Heater/Fan
Office automation equipment and computer peripherals
Mobile computers
Dryers
Xbox
The manufacturer of this component is NXP USA Inc., a company specializing in the production of Embedded - Microprocessors chips. This specific chip falls under the category of Embedded - Microprocessors. It is available in a 783-BBGA or FCBGA package/case and has an operating temperature range of 0°C to 105°C. The series of this chip is MPC85xx and it is currently considered obsolete. Its Moisture Sensitivity Level (MSL) is 3, meaning it can be exposed to moisture for up to 168 hours. The core processor of this chip is PowerPC e500, and it also features additional interfaces such as DUART, I2C, PCI, and RapidIO. It has co-processors/DSPs for signal processing and security, including cryptography and a random number generator. This chip is currently not compliant with RoHS standards.
MPC8545EPXANGD Features
PowerPC e500 Core
MPC8545EPXANGD Applications
There are a lot of NXP USA Inc. MPC8545EPXANGD Microprocessor applications.
Smartphone
Light sensing & controlling devices
Fire detection & safety devices
Communication-bluetooth, Wi-Fi, radio
Day to day life field
Heater/Fan
Office automation equipment and computer peripherals
Mobile computers
Dryers
Xbox
MPC8545EPXANGD More Descriptions
MPU MPC85xx RISC 32bit 0.09um 800MHz 1.8V/2.5V/3.3V 783-Pin FCBGA Tray
IC MPU MPC85XX 800MHZ 783FCBGA
PowerQUICC 32-Bit Power Arch SoC, 800MHz, GbE, PCI, PCI-X, PCIe, SRIO, DDR2, ECC, SEC, 0 to 105C, R3
Microprocessors - MPU PQ38 PB ST WE 800 R3.0
IC MPU MPC85XX 800MHZ 783FCBGA
PowerQUICC 32-Bit Power Arch SoC, 800MHz, GbE, PCI, PCI-X, PCIe, SRIO, DDR2, ECC, SEC, 0 to 105C, R3
Microprocessors - MPU PQ38 PB ST WE 800 R3.0
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