NXP USA Inc. MPC852TVR66A

Name: MPC852TVR66A
Brand: NXP USA Inc.
SKU: 3161123-MPC852TVR66A
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: MPC852TVR66A

Manufacturer:: NXP USA Inc.

Ventron No:: 3161123-MPC852TVR66A

Description:: IC MPU MPC8XX 66MHZ 256BGA

ECAD Model:

Datasheet:: MPC852TVR66A

Specifications

NXP USA Inc. MPC852TVR66A technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC852TVR66A.

Factory Lead Time
12 Weeks
Package / Case
256-BBGA
Surface Mount
YES
Operating Temperature
0°C~95°C TA
Packaging
Tray
Published
1999
Series
MPC8xx
JESD-609 Code
e1
Part Status
Last Time Buy
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
256
ECCN Code
3A991.A.2
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.31.00.01
Subcategory
Other uPs/uCs/Peripheral ICs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1.8V
Terminal Pitch
1.27mm
Reflow Temperature-Max (s)
30
Base Part Number
MPC852
JESD-30 Code
S-PBGA-B256
Supply Voltage-Max (Vsup)
1.9V
Power Supplies
1.83.3V
Supply Voltage-Min (Vsup)
1.7V
Speed
66MHz
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Clock Frequency
66MHz
Bit Size
32
Address Bus Width
32
Boundary Scan
YES
Low Power Mode
YES
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
Voltage - I/O
3.3V
Ethernet
10Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
DRAM
Additional Interfaces
HDLC/SDLC, PCMCIA, SPI, UART
Co-Processors/DSP
Communications; CPM
Height Seated (Max)
2.54mm
Length
23mm
RoHS Status
ROHS3 Compliant

Description

MPC852TVR66A Overview
The package or case for this particular electronic component is a 256-BBGA, which stands for Ball Grid Array with 256 balls. It is designed for surface mount installation, meaning it can be directly mounted onto a circuit board. The terminal position is located on the bottom of the package, and the terminal form is in the shape of a ball. The supply voltage required for this component is 1.8V. When it comes to reflow temperature, the maximum time allowed is 30 seconds. This component is classified under the JESD-30 Code S-PBGA-B256, which stands for Plastic Ball Grid Array with 256 balls. It falls under the category of uPs/uCs/Peripheral ICs, specifically as a microprocessor with a RISC architecture. The Ethernet connection for this component supports speeds of up to 10Mbps, and it does not have graphics acceleration capabilities.

MPC852TVR66A Features
32-Bit Structure

MPC852TVR66A Applications
There are a lot of NXP USA Inc. MPC852TVR66A Microprocessor applications.

Equipment control
Scanners
Industrial instrumentation devices
DCS control intelligent sensor
DDC control
Mobile computers
Washing machines
Pacemakers (used to control abnormal heart rhythm)
Entertainment products
Safety -airbags, automatic braking system (ABS)

MPC852TVR66A More Descriptions

MPU MPC8xx RISC 32-Bit 0.18um 66MHz 3.3V 256-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)
MPU, 32BIT, 66MHZ, BGA-256; Series:PowerQUICC I; Core Size:32bit; Program Memory Size:-; Supply Voltage Min:1.7V; Supply Voltage Max:1.9V; Digital IC Case Style:BGA; No. of Pins:256; CPU Speed:66MHz; Embedded Interface Type:SPI, UART; Operating Temperature Min:0°C; Operating Temperature Max:95°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013)

Certification