MPC850CZQ50BU

NXP USA Inc. MPC850CZQ50BU

Part Number:
MPC850CZQ50BU
Manufacturer:
NXP USA Inc.
Ventron No:
3667386-MPC850CZQ50BU
Description:
IC MPU MPC8XX 50MHZ 256BGA
ECAD Model:
Datasheet:
MPC850 PowerQUICC

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Specifications
NXP USA Inc. MPC850CZQ50BU technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC850CZQ50BU.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    256-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~95°C TA
  • Packaging
    Tray
  • Published
    1997
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MPC850
  • JESD-30 Code
    S-PBGA-B256
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    50MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    26
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • USB
    USB 1.x (1)
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.35mm
  • Length
    23mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC850CZQ50BU Overview
The Surface Mount technology has become increasingly popular due to its compact size and efficient design. With an operating temperature range of -40°C to 95°C TA, it is suitable for a wide range of applications. The JESD-609 Code e0 ensures its high reliability and performance. However, despite its advantages, this technology is now considered obsolete, as newer and more advanced options have emerged. The terminal form of this surface mount is BALL, making it easy to mount on a circuit board. It has a speed of 50MHz and a voltage of 3.3V for I/O. In addition to Ethernet, it also offers additional interfaces such as HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, and UART/USART. With a length of 23mm, it is a compact and versatile option for various electronic devices.

MPC850CZQ50BU Features
32-Bit Structure

MPC850CZQ50BU Applications
There are a lot of NXP USA Inc. MPC850CZQ50BU Microprocessor applications.

Removable disks
Calculator
Instrument control
8. Navigation control field
Guidance-GPS
Day to day life field
DCS control intelligent sensor
Broadband technology, video and voice processing
Teletext terminals
Tape drives
MPC850CZQ50BU More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 50MHz 3.3V/5V 256-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 256-PBGA (23x23)
Powerquicc, 32 Bit Power Architecture, 50Mhz, Communications Processor, -40 To 95C
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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