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MPC8360EZUAJDG

NXP USA Inc. MPC8360EZUAJDG

Part Number:
MPC8360EZUAJDG
Manufacturer:
NXP USA Inc.
Ventron No:
3827585-MPC8360EZUAJDG
Description:
IC MPU MPC83XX 533MHZ 740TBGA
ECAD Model:
Datasheet:
MPC8360E/MPC8358E

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Specifications
NXP USA Inc. MPC8360EZUAJDG technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8360EZUAJDG.
  • Package / Case
    740-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~105°C TA
  • Packaging
    Tray
  • Published
    2006
  • Series
    MPC83xx
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    740
  • ECCN Code
    5A002.A.1
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.3V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MPC8360
  • JESD-30 Code
    S-PBGA-B740
  • Supply Voltage-Max (Vsup)
    1.35V
  • Supply Voltage-Min (Vsup)
    1.15V
  • Speed
    533MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Core Processor
    PowerPC e300
  • Clock Frequency
    66.67MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FLOATING POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    1.8V 2.5V 3.3V
  • Ethernet
    10/100/1000Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR, DDR2
  • USB
    USB 1.x (1)
  • Additional Interfaces
    DUART, HDLC, I2C, PCI, SPI, UART
  • Co-Processors/DSP
    Communications; QUICC Engine, Security; SEC
  • Security Features
    Cryptography, Random Number Generator
  • Height Seated (Max)
    1.69mm
  • Length
    37.5mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC8360EZUAJDG Overview
The manufacturer of this component is NXP USA Inc., a company that specializes in producing embedded microprocessors. This specific chip falls under the category of embedded microprocessors. It has an operating temperature range of 0°C to 105°C and was first published in 2006. The chip belongs to the MPC83xx series and is currently considered obsolete. It utilizes CMOS technology and can withstand a peak reflow temperature of 260 degrees Celsius. The terminal pitch, or distance between each terminal, is 1mm. It is classified under the JESD-30 code S-PBGA-B740 and falls under the category of microprocessors, specifically RISC (reduced instruction set computer). The external data bus width of this chip is 32 bits.

MPC8360EZUAJDG Features
PowerPC e300 Core
32-Bit Structure

MPC8360EZUAJDG Applications
There are a lot of NXP USA Inc. MPC8360EZUAJDG Microprocessor applications.

Magnetic resonance imaging (MRI)
Toys
Glucose monitoring systems (for Type 1 Diabetes)
Copiers
Broadband technology, video and voice processing
Microwave ovens
Robots
Blenders
Leakage current tester
Calculators
MPC8360EZUAJDG More Descriptions
IC MPU MPC83XX 533MHZ 740TBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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