MPC8360ECZUAJDGA

NXP USA Inc. MPC8360ECZUAJDGA

Part Number:
MPC8360ECZUAJDGA
Manufacturer:
NXP USA Inc.
Ventron No:
3161668-MPC8360ECZUAJDGA
Description:
IC MPU MPC83XX 533MHZ 740TBGA
ECAD Model:
Datasheet:
MPC8360E/MPC8358E

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Specifications
NXP USA Inc. MPC8360ECZUAJDGA technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8360ECZUAJDGA.
  • Package / Case
    740-LBGA
  • Supplier Device Package
    740-TBGA (37.5x37.5)
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Series
    MPC83xx
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Speed
    533MHz
  • Core Processor
    PowerPC e300
  • Voltage - I/O
    1.8V 2.5V 3.3V
  • Ethernet
    10/100/1000Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR, DDR2
  • USB
    USB 1.x (1)
  • Additional Interfaces
    DUART, HDLC, I2C, PCI, SPI, UART
  • Co-Processors/DSP
    Communications; QUICC Engine, Security; SEC
  • Security Features
    Cryptography, Random Number Generator
  • RoHS Status
    Non-RoHS Compliant
Description
MPC8360ECZUAJDGA Overview
NXP USA Inc. is a highly reputable brand in the field of electronic components, particularly in the development and production of Embedded - Microprocessors chips. These chips are essential in various industries, such as automotive, consumer electronics, and industrial automation. One of the key features of this particular part from NXP USA Inc. is its package/case, which is 740-LBGA. This type of package is known for its high reliability and robustness, making it suitable for harsh environments. It also allows for efficient heat dissipation, ensuring the chip's stable performance. The operating temperature of this chip is -40°C~105°C TA, making it suitable for use in a wide range of applications, even in extreme conditions. This temperature range is a crucial parameter to consider, as it directly affects the chip's performance and longevity. The MPC83xx series is another important aspect of this chip. This series is known for its high processing power and advanced features, making it a top choice for many industrial and commercial applications. However, it is worth noting that this particular part is currently in an obsolete status, which means that it may no longer be in production. In terms of moisture sensitivity, this chip has an MSL rating of 3 (168 Hours). This rating indicates the level of protection needed to prevent moisture damage during storage and handling. It is crucial to adhere to the recommended storage and handling guidelines to ensure the chip's optimal performance. The speed of this chip is 533MHz, which is quite impressive for an Embedded - Microprocessors chip. This high speed allows for faster data processing, making it suitable for applications that require real-time data processing, such as in the automotive industry. The core processor of this chip is PowerPC e300, which is known for its high performance and low power consumption. This processor is based on the Power Architecture instruction set, making it compatible with various software and applications. In terms of voltage, this chip has a range of options, including 1.8V, 2.5V, and 3.3V for I/O. This flexibility in voltage options allows for compatibility with different power supply systems, making it suitable for a wide range of applications. Furthermore, this chip features an Ethernet interface with a speed of 10/100/1000Mbps (1). This high-speed Ethernet allows for fast and reliable data transfer, making it suitable for applications that require high bandwidth, such as video streaming and data-intensive processes. Lastly, this chip boasts advanced security features, such as cryptography and a random number generator. These features are crucial for applications that require secure data transmission and storage, such as in the banking and finance industry. In conclusion, the NXP USA Inc. Embedded - Microprocessors chip with the part number MPC83xx is a highly advanced and versatile component suitable for a wide range of applications. Its impressive features, such as high speed, advanced security, and flexible voltage options, make it a top choice for many industries. However, with its current obsolete status, it is essential to consider the availability and potential alternatives before using this chip in a project.

MPC8360ECZUAJDGA Features
PowerPC e300 Core

MPC8360ECZUAJDGA Applications
There are a lot of Rochester Electronics, LLC MPC8360ECZUAJDGA Microprocessor applications.

Entertainment products
Robots
Keyboards
Safety -airbags, automatic braking system (ABS)
Washing machine
Paper shredders
Industrial control field
Mice
Smoke alarms
Heater/Fan
MPC8360ECZUAJDGA More Descriptions
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 0.13um 533MHz 1.8V/2.5V/3.3V 740-Pin TBGA Tray
FLOATING POINT MICROPROCESSOR RISC USB 1.x (1) BALL IC Microprocessor -40C~105C TA 37.5mm 1.15V 66.67MHz
Microprocessors - MPU 8360 TBGA C ENCRP
PowerQUICC, 32 Bit Power Arch SoC, 533MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, SEC, -40 to 105C, Rev 1
IC MPU POWERQUICC II PRO 740TBGA
IC SOC 2CORE 1200MHZ SW 780FCBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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