NXP USA Inc. MPC8360ECZUAJDG

MPC8360ECZUAJDG Overview
This particular component is manufactured by NXP USA Inc. and falls under the category of Embedded - Microprocessors. It is a chip designed for embedded systems and is commonly used in microcontrollers. The packaging for this chip is in a tray format and it was first published in 2006. The JESD-609 code associated with this chip is e0, indicating its package type. The part is currently listed as obsolete, meaning it is no longer in production. It has a total of 740 terminations, which are the points where it connects to other components. The maximum peak reflow temperature for this chip is 260 degrees Celsius. Its JESD-30 code is S-PBGA-B740, indicating its package type and number of balls. The chip has a speed of 533MHz and an address bus width of 32 bits. Its maximum seated height is 1.69mm.

MPC8360ECZUAJDG Features
PowerPC e300 Core
32-Bit Structure

MPC8360ECZUAJDG Applications
There are a lot of NXP USA Inc. MPC8360ECZUAJDG Microprocessor applications.

Smart instruments
Calculator
Vacuum cleaners
Set-top boxes
Fire detection & safety devices
Oil and gas
Radio
Traditional industrial transformation
Food and beverage
Information appliances (networking of household appliances)