NXP USA Inc. MPC8360ECVVAGDGA
- Part Number:
- MPC8360ECVVAGDGA
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3667572-MPC8360ECVVAGDGA
- Description:
- IC MPU MPC83XX 400MHZ 740TBGA
- ECAD Model:
-
- Datasheet:
- MPC8360E/MPC8358E
NXP USA Inc. MPC8360ECVVAGDGA technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8360ECVVAGDGA.
- Factory Lead Time12 Weeks
- Package / Case740-LBGA
- Surface MountYES
- Operating Temperature-40°C~105°C TA
- PackagingTray
- Published2002
- SeriesMPC83xx
- JESD-609 Codee2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations740
- ECCN Code5A002.A.1
- Terminal FinishTIN COPPER/TIN SILVER
- HTS Code8542.31.00.01
- SubcategoryMicroprocessors
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)40
- Base Part NumberMPC8360
- JESD-30 CodeS-PBGA-B740
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.8/2.53.3V
- Supply Voltage-Min (Vsup)1.14V
- Speed400MHz
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
- Core ProcessorPowerPC e300
- Clock Frequency66.67MHz
- Bit Size32
- Address Bus Width32
- Boundary ScanYES
- Low Power ModeYES
- External Data Bus Width32
- FormatFLOATING POINT
- Integrated CacheYES
- Voltage - I/O1.8V 2.5V 3.3V
- Ethernet10/100/1000Mbps (1)
- Number of Cores/Bus Width1 Core 32-Bit
- Graphics AccelerationNo
- RAM ControllersDDR, DDR2
- USBUSB 1.x (1)
- Additional InterfacesDUART, HDLC, I2C, PCI, SPI, UART
- Co-Processors/DSPCommunications; QUICC Engine, Security; SEC
- Security FeaturesCryptography, Random Number Generator
- Height Seated (Max)1.69mm
- Length37.5mm
- RoHS StatusROHS3 Compliant
MPC8360ECVVAGDGA Overview
This particular component is manufactured by NXP USA Inc. and falls under the category of Embedded - Microprocessors. It is a type of chip designed to be embedded in electronic devices. The operating temperature range for this chip is -40°C to 105°C, and it was originally released in 2002. The part is currently in active production. It has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand exposure to moisture for up to 168 hours. The terminal position for this chip is located at the bottom. It requires power supplies of 1.8/2.53.3V and has a speed of 400MHz. The core processor for this chip is a PowerPC e300. It also has USB 1.x (1) capabilities and includes co-processors/DSP for communications and security purposes.
MPC8360ECVVAGDGA Features
PowerPC e300 Core
32-Bit Structure
MPC8360ECVVAGDGA Applications
There are a lot of NXP USA Inc. MPC8360ECVVAGDGA Microprocessor applications.
Sonography (Ultrasound imaging)
Answering machines
Air fryers
Telephone sets
Home appliances
Process control devices
Security systems
Home video and audio
Fabric
Projectors
This particular component is manufactured by NXP USA Inc. and falls under the category of Embedded - Microprocessors. It is a type of chip designed to be embedded in electronic devices. The operating temperature range for this chip is -40°C to 105°C, and it was originally released in 2002. The part is currently in active production. It has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand exposure to moisture for up to 168 hours. The terminal position for this chip is located at the bottom. It requires power supplies of 1.8/2.53.3V and has a speed of 400MHz. The core processor for this chip is a PowerPC e300. It also has USB 1.x (1) capabilities and includes co-processors/DSP for communications and security purposes.
MPC8360ECVVAGDGA Features
PowerPC e300 Core
32-Bit Structure
MPC8360ECVVAGDGA Applications
There are a lot of NXP USA Inc. MPC8360ECVVAGDGA Microprocessor applications.
Sonography (Ultrasound imaging)
Answering machines
Air fryers
Telephone sets
Home appliances
Process control devices
Security systems
Home video and audio
Fabric
Projectors
MPC8360ECVVAGDGA More Descriptions
MPU MPC83xx RISC 32-Bit 0.13um 400MHz 1.8V/2.5V/3.3V 740-Pin T-BGA Tray
Ic,microprocessor,32-Bit,cmos,bga,740Pin,plastic Rohs Compliant: Yes |Nxp MPC8360ECVVAGDGA
Microprocessors - MPU 8360 TBGA C ENC NO-PB
PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, SEC, -40 to 105C, Rev 1
IC MPU POWERQUICC II PRO 740TBGA
Supervisory Circuits 4.0V Detector
POWERQUICC 32 BIT POWER ARCH SOC
Ic,microprocessor,32-Bit,cmos,bga,740Pin,plastic Rohs Compliant: Yes |Nxp MPC8360ECVVAGDGA
Microprocessors - MPU 8360 TBGA C ENC NO-PB
PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, SEC, -40 to 105C, Rev 1
IC MPU POWERQUICC II PRO 740TBGA
Supervisory Circuits 4.0V Detector
POWERQUICC 32 BIT POWER ARCH SOC
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