NXP USA Inc. MPC8360CVVADDH

MPC8360CVVADDH Overview
The manufacturer of this component is NXP USA Inc. It is a type of chip used for Embedded - Microprocessors, falling under the category of Embedded - Microprocessors. The package/case for this chip is 740-LBGA and the supplier device package is 740-TBGA with dimensions of 37.5x37.5. It is designed to operate within a temperature range of -40°C to 105°C, indicated by the TA symbol. This part is no longer in production, making it obsolete. Its Moisture Sensitivity Level (MSL) is 3, meaning it can withstand exposure to moisture for up to 168 hours. The chip has a speed of 266MHz and is powered by a PowerPC e300 core processor. It has one core with a bus width of 32-bits. This chip does not have graphics acceleration and is compatible with DDR and DDR2 RAM controllers.

MPC8360CVVADDH Features
PowerPC e300 Core

MPC8360CVVADDH Applications
There are a lot of NXP USA Inc. MPC8360CVVADDH Microprocessor applications.

Graphic terminals
Entertainment products
Toys
Industrial control field
Dishwashers
Fire alarms
Removable disks
Pacemakers (used to control abnormal heart rhythm)
Kindle
Safety -airbags, automatic braking system (ABS)