NXP USA Inc. MPC8347ZQAGDB

MPC8347ZQAGDB Overview
The specific manufacturer of this component is NXP USA Inc. It is a type of chip known as Embedded - Microprocessors, which falls under the larger category of Embedded - Microprocessors. The package or case of the chip is 620-BBGA Exposed Pad, and it is typically packaged in trays. This particular chip was first published in 2009 and belongs to the MPC83xx series. It has a Moisture Sensitivity Level (MSL) rating of 3, meaning it can withstand up to 168 hours of exposure to moisture. The core processor of this chip is the PowerPC e300. It does not have graphics acceleration capabilities. The RAM controllers are designed for DDR memory. The chip also includes USB 2.0 and two physical layer interfaces (PHY). Additional interfaces included are DUART, I2C, PCI, and SPI.

MPC8347ZQAGDB Features
PowerPC e300 Core

MPC8347ZQAGDB Applications
There are a lot of NXP USA Inc. MPC8347ZQAGDB Microprocessor applications.

Gas monitoring systems
Blenders
Electronic jamming systems
Laminators
Hard drives
Traditional industrial transformation
Digital set-top boxes
3D printers
Equipment control
Metering & measurement field