MPC8309CVMADDCA

NXP USA Inc. MPC8309CVMADDCA

Part Number:
MPC8309CVMADDCA
Manufacturer:
NXP USA Inc.
Ventron No:
3667118-MPC8309CVMADDCA
Description:
IC MPU MPC83XX 266MHZ 489BGA
ECAD Model:
Datasheet:
MPC8309CVMADDCA

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
NXP USA Inc. MPC8309CVMADDCA technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8309CVMADDCA.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    489-LFBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    2002
  • Series
    MPC83xx
  • JESD-609 Code
    e2
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    489
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    TIN COPPER/TIN SILVER
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1V
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MPC8309
  • JESD-30 Code
    S-PBGA-B489
  • Supply Voltage-Max (Vsup)
    1.05V
  • Power Supplies
    1V
  • Supply Voltage-Min (Vsup)
    0.95V
  • Speed
    266MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Core Processor
    PowerPC e300c3
  • Clock Frequency
    66.67MHz
  • Bit Size
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • Format
    FLOATING POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    1.8V 3.3V
  • Ethernet
    10/100Mbps (3)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR2
  • USB
    USB 2.0 (1)
  • Additional Interfaces
    CAN, DUART, I2C, MMC/SD, SPI, TDM
  • Co-Processors/DSP
    Communications; QUICC Engine
  • Height Seated (Max)
    1.61mm
  • Length
    19mm
  • RoHS Status
    ROHS3 Compliant
Description
MPC8309CVMADDCA Overview
The 489-LFBGA package or case is designed for surface mount applications and is published in 2002. This packaging is tray-style and is still an active part in the market. It has a moisture sensitivity level of 3, meaning it can withstand up to 168 hours of exposure to moisture. The technology used in this package is CMOS, which stands for Complementary Metal-Oxide-Semiconductor. The core processor is a PowerPC e300c3, known for its efficient and powerful performance. Additionally, this package has a low power mode, making it energy efficient. The maximum seated height of this package is 1.61mm, making it suitable for compact and slim devices.

MPC8309CVMADDCA Features
PowerPC e300c3 Core
32-Bit Structure

MPC8309CVMADDCA Applications
There are a lot of NXP USA Inc. MPC8309CVMADDCA Microprocessor applications.

Broadband technology, video and voice processing
Smart highways (navigation, traffic control, information monitoring and car service)
Computer/laptop
Day to day life field
Smoke alarms
Equipment control
Communication-bluetooth, Wi-Fi, radio
DDC control
Robots
Measuring revolving objects
MPC8309CVMADDCA More Descriptions
MPU MPC83xx RISC 32-Bit 0.09um 266MHz 1.8V/3.3V 489-Pin MAPBGA Tray
RISC Microprocessor, 32-Bit, 266MHz, CMOS, PBGA489
MPU Core = e300 / Data Bus Width Bit = 32 / Family Name = PowerQUICC / Cores = 1 / Clock Frequency Max. MHz = 266 / Interfaces = USB / Interfaces = Ethernet / Interfaces = I²C / Interfaces = SPI / Interfaces = UART / Interfaces = PCI / Interfaces = SDHC / Interfaces = TDM / L1 Cache Instruction Memory KB = 16 / L1 Cache Data Memory KB = 16 / Number of Timers/Counters = 10 / I/O Voltage V = 3.3 / Supply Voltage Min. mV = 950 / Supply Voltage Max. V = 1.05 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 105 / Package Type = LFBGA / Pins = 489 / Mounting Type = SMD / MSL = Level-3 / Packaging = Tray / Length mm = 19 / Width mm = 19 / Height mm = 1.61 / Reflow Temperature Max. °C = 260
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 19 September 2023

    Comparison Between 2N3055 vs TIP3055

    Ⅰ. Overview of 2N3055Ⅱ. Overview of TIP3055Ⅲ. Pin diagram comparisonⅣ. Technical parametersⅤ. Comparison of current amplification factorsⅥ. Package comparisonⅦ. Symbol of 2N3055 and TIP3055Ⅷ. Application scenarios comparisonⅨ. Can...
  • 19 September 2023

    STM32F303CCT6 Microcontroller: Footprint, Equivalent and Advantages

    Ⅰ. What is STM32F303CCT6?Ⅱ. 3D Model and footprint of STM32F303CCT6Ⅲ. Technical parametersⅣ. Features of STM32F303CCT6Ⅴ. Package and packaging of STM32F303CCT6Ⅵ. Typical and maximum current consumptionⅦ. Advantages of STM32F303CCT6...
  • 20 September 2023

    ATMEGA8-16PU Microcontroller: Symbol, Equivalent and Electrical Characteristics

    Ⅰ. Overview of ATMEGA8-16PUⅡ. Symbol, Footprint and Pin Configuration of ATMEGA8-16PUⅢ. Technical parametersⅣ. Electrical characteristics of ATMEGA8-16PUⅤ. What is the difference between ATMEGA8-16PU and ATMEGA8-16PI?Ⅵ. I/O Memory of...
  • 20 September 2023

    The Pinout, Advantages, and Electrical Characteristics of AO4466

    Ⅰ. What is AO4466?Ⅱ. Symbol, Pinout and Footprint of AO4466Ⅲ. Technical parametersⅣ. What are the advantages of AO4466?Ⅴ. Application fields of AO4466Ⅵ. Typical electrical characteristicsⅦ. How to detect...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.