NXP USA Inc. MPC8306SCVMAFDCA
- Part Number:
- MPC8306SCVMAFDCA
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3667033-MPC8306SCVMAFDCA
- Description:
- IC MPU MPC83XX 333MHZ 369BGA
- Datasheet:
- MPC8306SCVMAFDCA
NXP USA Inc. MPC8306SCVMAFDCA technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8306SCVMAFDCA.
- Factory Lead Time10 Weeks
- Package / Case369-LFBGA
- Surface MountYES
- Operating Temperature-40°C~105°C TA
- PackagingTray
- Published2002
- SeriesMPC83xx
- JESD-609 Codee2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations369
- ECCN Code3A991.A.2
- Terminal FinishTIN COPPER/TIN SILVER
- HTS Code8542.31.00.01
- SubcategoryMicroprocessors
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1V
- Terminal Pitch0.8mm
- Reflow Temperature-Max (s)40
- Base Part NumberMPC8306
- JESD-30 CodeS-PBGA-B369
- Supply Voltage-Max (Vsup)1.05V
- Power Supplies11.83.3V
- Supply Voltage-Min (Vsup)0.95V
- Speed333MHz
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
- Core ProcessorPowerPC e300c3
- Clock Frequency66.67MHz
- Bit Size32
- Boundary ScanYES
- Low Power ModeYES
- FormatFLOATING POINT
- Integrated CacheYES
- Voltage - I/O1.8V 3.3V
- Ethernet10/100Mbps (3)
- Number of Cores/Bus Width1 Core 32-Bit
- Graphics AccelerationNo
- RAM ControllersDDR2
- USBUSB 2.0 (1)
- Additional InterfacesDUART, I2C, SPI, TDM
- Co-Processors/DSPCommunications; QUICC Engine
- Height Seated (Max)1.61mm
- Length19mm
- RoHS StatusROHS3 Compliant
MPC8306SCVMAFDCA Overview
NXP USA Inc. is a well-known brand in the world of technology and electronics. It specializes in producing high-quality embedded microprocessors, which are essential components in many electronic devices. These chips are part of the Embedded - Microprocessors category, which is a highly competitive and constantly evolving market. NXP USA Inc. has established itself as a leader in this field, thanks to its innovative and reliable products. One of the key features of this particular chip is its packaging. It comes in a tray, which is a common and convenient way to store and transport electronic components. This ensures that the chip is well-protected and can be easily handled during the manufacturing process. Moreover, the terminal finish of the chip is TIN COPPER/TIN SILVER, which provides excellent conductivity and corrosion resistance, ensuring the chip's longevity and performance. In terms of technology, this chip utilizes CMOS (Complementary Metal-Oxide-Semiconductor) technology, which is known for its low power consumption and high speed. This makes the chip energy-efficient and suitable for a wide range of applications. The terminal form of the chip is BALL, which is a popular choice in the industry due to its ease of use and reliability. The supply voltage for this chip is 1V, which is within the standard range for similar embedded microprocessors. The reflow temperature-max (s) is 40, indicating the maximum temperature that the chip can withstand during the soldering process. This ensures that the chip remains stable and functional even under high-temperature conditions. When it comes to power supplies, this chip requires 11.83.3V, which is a relatively low voltage compared to other microprocessors in the market. This makes it suitable for low-power applications while still delivering high performance. The supply voltage-min (Vsup) is 0.95V, which is the minimum voltage required for the chip to function correctly. It is crucial to ensure that the chip receives the appropriate voltage to avoid any potential damage or malfunction. This chip is equipped with 1 core and a 32-bit bus width, making it a powerful and efficient processor. It also has co-processors/DSP capabilities, specifically in the area of communications and QUICC engine. This means that the chip can handle complex tasks and data processing, making it suitable for a wide range of applications in various industries. In conclusion, the NXP USA Inc. Embedded - Microprocessors chip is a top-of-the-line product that offers high performance, reliability, and versatility. Its packaging, technology, and power requirements make it a convenient and efficient choice for many electronic devices. With its advanced features and capabilities, it is no surprise that NXP USA Inc. is a trusted brand by many in the technology industry.
MPC8306SCVMAFDCA Features
PowerPC e300c3 Core
32-Bit Structure
MPC8306SCVMAFDCA Applications
There are a lot of NXP USA Inc. MPC8306SCVMAFDCA Microprocessor applications.
Instrumentation and process control field
Copiers
Information appliances (networking of household appliances)
Set-top boxes
Keyboards
Industrial instrumentation devices
Blenders
Security systems
Fax machines
ECG machine
NXP USA Inc. is a well-known brand in the world of technology and electronics. It specializes in producing high-quality embedded microprocessors, which are essential components in many electronic devices. These chips are part of the Embedded - Microprocessors category, which is a highly competitive and constantly evolving market. NXP USA Inc. has established itself as a leader in this field, thanks to its innovative and reliable products. One of the key features of this particular chip is its packaging. It comes in a tray, which is a common and convenient way to store and transport electronic components. This ensures that the chip is well-protected and can be easily handled during the manufacturing process. Moreover, the terminal finish of the chip is TIN COPPER/TIN SILVER, which provides excellent conductivity and corrosion resistance, ensuring the chip's longevity and performance. In terms of technology, this chip utilizes CMOS (Complementary Metal-Oxide-Semiconductor) technology, which is known for its low power consumption and high speed. This makes the chip energy-efficient and suitable for a wide range of applications. The terminal form of the chip is BALL, which is a popular choice in the industry due to its ease of use and reliability. The supply voltage for this chip is 1V, which is within the standard range for similar embedded microprocessors. The reflow temperature-max (s) is 40, indicating the maximum temperature that the chip can withstand during the soldering process. This ensures that the chip remains stable and functional even under high-temperature conditions. When it comes to power supplies, this chip requires 11.83.3V, which is a relatively low voltage compared to other microprocessors in the market. This makes it suitable for low-power applications while still delivering high performance. The supply voltage-min (Vsup) is 0.95V, which is the minimum voltage required for the chip to function correctly. It is crucial to ensure that the chip receives the appropriate voltage to avoid any potential damage or malfunction. This chip is equipped with 1 core and a 32-bit bus width, making it a powerful and efficient processor. It also has co-processors/DSP capabilities, specifically in the area of communications and QUICC engine. This means that the chip can handle complex tasks and data processing, making it suitable for a wide range of applications in various industries. In conclusion, the NXP USA Inc. Embedded - Microprocessors chip is a top-of-the-line product that offers high performance, reliability, and versatility. Its packaging, technology, and power requirements make it a convenient and efficient choice for many electronic devices. With its advanced features and capabilities, it is no surprise that NXP USA Inc. is a trusted brand by many in the technology industry.
MPC8306SCVMAFDCA Features
PowerPC e300c3 Core
32-Bit Structure
MPC8306SCVMAFDCA Applications
There are a lot of NXP USA Inc. MPC8306SCVMAFDCA Microprocessor applications.
Instrumentation and process control field
Copiers
Information appliances (networking of household appliances)
Set-top boxes
Keyboards
Industrial instrumentation devices
Blenders
Security systems
Fax machines
ECG machine
MPC8306SCVMAFDCA More Descriptions
MPU PowerQUICC II Pro RISC 32bit 0.09um 333MHz 369-Pin MAP-BGA Tray
PowerQUICC, Power Arch SoC, 333MHz, DDR2, HDLC, TDM, Enet, USB, -40 to 105C, Rev 1.1 RoHS Compliant: Yes
Microprocessors - MPU E300 MP ext tmp 333
POWERQUICC POWER ARCH SOC, 333MH
PowerQUICC, Power Arch SoC, 333MHz, DDR2, HDLC, TDM, Enet, USB, -40 to 105C, Rev 1.1 RoHS Compliant: Yes
Microprocessors - MPU E300 MP ext tmp 333
POWERQUICC POWER ARCH SOC, 333MH
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