MPC8306SCVMAFDCA

NXP USA Inc. MPC8306SCVMAFDCA

Part Number:
MPC8306SCVMAFDCA
Manufacturer:
NXP USA Inc.
Ventron No:
3667033-MPC8306SCVMAFDCA
Description:
IC MPU MPC83XX 333MHZ 369BGA
ECAD Model:
Datasheet:
MPC8306SCVMAFDCA

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Specifications
NXP USA Inc. MPC8306SCVMAFDCA technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8306SCVMAFDCA.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    369-LFBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    2002
  • Series
    MPC83xx
  • JESD-609 Code
    e2
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    369
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    TIN COPPER/TIN SILVER
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1V
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MPC8306
  • JESD-30 Code
    S-PBGA-B369
  • Supply Voltage-Max (Vsup)
    1.05V
  • Power Supplies
    11.83.3V
  • Supply Voltage-Min (Vsup)
    0.95V
  • Speed
    333MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Core Processor
    PowerPC e300c3
  • Clock Frequency
    66.67MHz
  • Bit Size
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • Format
    FLOATING POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    1.8V 3.3V
  • Ethernet
    10/100Mbps (3)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR2
  • USB
    USB 2.0 (1)
  • Additional Interfaces
    DUART, I2C, SPI, TDM
  • Co-Processors/DSP
    Communications; QUICC Engine
  • Height Seated (Max)
    1.61mm
  • Length
    19mm
  • RoHS Status
    ROHS3 Compliant
Description
MPC8306SCVMAFDCA Overview
NXP USA Inc. is a well-known brand in the world of technology and electronics. It specializes in producing high-quality embedded microprocessors, which are essential components in many electronic devices. These chips are part of the Embedded - Microprocessors category, which is a highly competitive and constantly evolving market. NXP USA Inc. has established itself as a leader in this field, thanks to its innovative and reliable products. One of the key features of this particular chip is its packaging. It comes in a tray, which is a common and convenient way to store and transport electronic components. This ensures that the chip is well-protected and can be easily handled during the manufacturing process. Moreover, the terminal finish of the chip is TIN COPPER/TIN SILVER, which provides excellent conductivity and corrosion resistance, ensuring the chip's longevity and performance. In terms of technology, this chip utilizes CMOS (Complementary Metal-Oxide-Semiconductor) technology, which is known for its low power consumption and high speed. This makes the chip energy-efficient and suitable for a wide range of applications. The terminal form of the chip is BALL, which is a popular choice in the industry due to its ease of use and reliability. The supply voltage for this chip is 1V, which is within the standard range for similar embedded microprocessors. The reflow temperature-max (s) is 40, indicating the maximum temperature that the chip can withstand during the soldering process. This ensures that the chip remains stable and functional even under high-temperature conditions. When it comes to power supplies, this chip requires 11.83.3V, which is a relatively low voltage compared to other microprocessors in the market. This makes it suitable for low-power applications while still delivering high performance. The supply voltage-min (Vsup) is 0.95V, which is the minimum voltage required for the chip to function correctly. It is crucial to ensure that the chip receives the appropriate voltage to avoid any potential damage or malfunction. This chip is equipped with 1 core and a 32-bit bus width, making it a powerful and efficient processor. It also has co-processors/DSP capabilities, specifically in the area of communications and QUICC engine. This means that the chip can handle complex tasks and data processing, making it suitable for a wide range of applications in various industries. In conclusion, the NXP USA Inc. Embedded - Microprocessors chip is a top-of-the-line product that offers high performance, reliability, and versatility. Its packaging, technology, and power requirements make it a convenient and efficient choice for many electronic devices. With its advanced features and capabilities, it is no surprise that NXP USA Inc. is a trusted brand by many in the technology industry.

MPC8306SCVMAFDCA Features
PowerPC e300c3 Core
32-Bit Structure

MPC8306SCVMAFDCA Applications
There are a lot of NXP USA Inc. MPC8306SCVMAFDCA Microprocessor applications.

Instrumentation and process control field
Copiers
Information appliances (networking of household appliances)
Set-top boxes
Keyboards
Industrial instrumentation devices
Blenders
Security systems
Fax machines
ECG machine
MPC8306SCVMAFDCA More Descriptions
MPU PowerQUICC II Pro RISC 32bit 0.09um 333MHz 369-Pin MAP-BGA Tray
PowerQUICC, Power Arch SoC, 333MHz, DDR2, HDLC, TDM, Enet, USB, -40 to 105C, Rev 1.1 RoHS Compliant: Yes
Microprocessors - MPU E300 MP ext tmp 333
POWERQUICC POWER ARCH SOC, 333MH
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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