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MPC8260ACVVMIBB

NXP USA Inc. MPC8260ACVVMIBB

Part Number:
MPC8260ACVVMIBB
Manufacturer:
NXP USA Inc.
Ventron No:
3161253-MPC8260ACVVMIBB
Description:
IC MPU MPC82XX 266MHZ 408TBGA
ECAD Model:
Datasheet:
MPC8260A Series

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Specifications
NXP USA Inc. MPC8260ACVVMIBB technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8260ACVVMIBB.
  • Package / Case
    480-LBGA Exposed Pad
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    1994
  • Series
    MPC82xx
  • JESD-609 Code
    e1
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    480
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    2.5V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    PC8260
  • JESD-30 Code
    S-PBGA-B480
  • Supply Voltage-Max (Vsup)
    2.7V
  • Supply Voltage-Min (Vsup)
    2.4V
  • Speed
    266MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Core Processor
    PowerPC G2
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    64
  • Format
    FLOATING POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10/100Mbps (3)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM, SDRAM
  • Additional Interfaces
    I2C, SCC, SMC, SPI, UART, USART
  • Co-Processors/DSP
    Communications; RISC CPM
  • Height Seated (Max)
    1.65mm
  • Length
    37.5mm
  • RoHS Status
    ROHS3 Compliant
Description
MPC8260ACVVMIBB Overview
The 480-LBGA Exposed Pad package or case is a type of technology that is now considered obsolete. It utilizes CMOS technology and has a terminal form of BALL. This package can withstand a peak reflow temperature of 260 degrees Celsius and operates at a speed of 266MHz. It has a bit size of 32 and an address bus width of 32. The RAM controllers for this package include DRAM and SDRAM. In addition, it also has multiple interfaces such as I2C, SCC, SMC, SPI, and UART, making it versatile and compatible with various devices. Despite its obsolete status, this package offers a range of features and capabilities that make it a reliable option for electronic devices.

MPC8260ACVVMIBB Features
PowerPC G2 Core
32-Bit Structure

MPC8260ACVVMIBB Applications
There are a lot of NXP USA Inc. MPC8260ACVVMIBB Microprocessor applications.

DCS control intelligent sensor
Automatic staplers
Fire detection & safety devices
Network communication, mobile communication field
Air fryers
Microwave ovens
Radio
Food and beverage
Home video and audio
Security systems
MPC8260ACVVMIBB More Descriptions
MPU PowerQUICC II MPC82xx Processor RISC 32-Bit 0.25um 266MHz 3.3V 480-Pin TBGA Tray
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 408-TBGA (37.5x37.5)
Microprocessors - MPU PQ II HIP4 REV B
IC-MP PPC 64BIT 266MHz BGA480 MIB SPEED
32-bit Communication Processors PQ II HIP4 REV B
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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