MPC8245LZU350D

NXP USA Inc. MPC8245LZU350D

Part Number:
MPC8245LZU350D
Manufacturer:
NXP USA Inc.
Ventron No:
3161465-MPC8245LZU350D
Description:
IC MPU MPC82XX 350MHZ 352TBGA
ECAD Model:
Datasheet:
MPC8245

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
NXP USA Inc. MPC8245LZU350D technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8245LZU350D.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    352-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~105°C TA
  • Packaging
    Tray
  • Published
    1998
  • Series
    MPC82xx
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    352
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    220
  • Supply Voltage
    2V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC8245
  • JESD-30 Code
    S-PBGA-B352
  • Supply Voltage-Max (Vsup)
    2.2V
  • Power Supplies
    23.3V
  • Supply Voltage-Min (Vsup)
    1.9V
  • Speed
    350MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Core Processor
    PowerPC 603e
  • Clock Frequency
    66MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FLOATING POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    SDRAM
  • Additional Interfaces
    I2C, I2O, PCI, UART
  • Height Seated (Max)
    1.65mm
  • Length
    35mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC8245LZU350D Overview
Moisture Sensitivity Level (MSL) refers to the level of sensitivity of electronic components to moisture and the potential damage it can cause. In this case, the MSL is 3, meaning that the component can be exposed to moisture for up to 168 hours before it becomes damaged. The HTS Code, 8542.31.00.01, is a code used for international trade that identifies the specific type of component. The Terminal Position is located at the bottom of the component, and the Terminal Form is in the shape of a ball. The JESD-30 Code, S-PBGA-B352, is a standardized code that describes the package type and size of the component. The power supply for this component is 23.3V, and the Address Bus Width is 32. Additionally, this component has Boundary Scan capabilities and a Voltage - I/O of 3.3V. It also has additional interfaces such as I2C, I2O, PCI, and UART.

MPC8245LZU350D Features
PowerPC 603e Core
32-Bit Structure

MPC8245LZU350D Applications
There are a lot of NXP USA Inc. MPC8245LZU350D Microprocessor applications.

Smartphones-calling, video calling, texting, email
Air fryers
Glucose monitoring systems (for Type 1 Diabetes)
Microwave ovens
Monitoring-temperature level, oil level, speed, distance, acceleration
Toys
Broadband technology, video and voice processing
Home video and audio
Christmas lights
Industrial instrumentation devices
MPC8245LZU350D More Descriptions
MPU PowerPC MPC82xx Processor RISC 64-Bit 0.25um 350MHz 3.3V 352-Pin TBGA Tray
PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 350MHz 352-TBGA (35x35)
IC, 32-BIT MPU, 350MHZ, BGA-352; Series:PowerQUICC II; Core Size:32bit; Program Memory Size:32KB; CPU Speed:350MHz; Embedded Interface Type:JTAG, I2C, PCI, UART; Digital IC Case Style:BGA; No. of Pins:352 ;RoHS Compliant: No
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 20 February 2024

    LM358DR2G Operational Amplifier Symbol, Features, Applications and More

    Ⅰ. Introduction to LM358DR2GⅡ. Technical parameters of LM358DR2GⅢ. Features of LM358DR2GⅣ. Symbol, footprint and pin configuration of LM358DR2GⅤ. Where is LM358DR2G used?Ⅵ. Circuit description of LM358DR2GⅦ. The difference...
  • 20 February 2024

    MB6S Rectifier Bridge Specifications, Working Principle and Features

    Ⅰ. Overview of MB6SⅡ. Specifications of MB6SⅢ. Working principle of MB6SⅣ. Circuit schematic diagram of MB6SⅤ. What are the features of MB6S?Ⅵ. Absolute maximum ratings of MB6SⅦ. How...
  • 21 February 2024

    EPCS16SI8N Manufacturer, Market Trend, Application Fields and More

    Ⅰ. Overview of EPCS16SI8NⅡ. Manufacturer of EPCS16SI8NⅢ. Specifications of EPCS16SI8NⅣ. Dimensions and package of EPCS16SI8NⅤ. Functional description of EPCS16SI8NⅥ. Application fields of EPCS16SI8NⅦ. Market trend of EPCS16SI8NⅧ. How...
  • 21 February 2024

    What is the ADS1118IDGSR and How Does it Work?

    Ⅰ. ADS1118IDGSR descriptionⅡ. Specifications of ADS1118IDGSRⅢ. Absolute maximum ratings of ADS1118IDGSRⅣ. How does ADS1118IDGSR work?Ⅴ. Package of ADS1118IDGSRⅥ. What are the characteristics of ADS1118IDGSR?Ⅶ. Typical application of ADS1118IDGSRⅧ....
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.