MF1SEP1031DUD/03V

NXP USA Inc. MF1SEP1031DUD/03V

Part Number:
MF1SEP1031DUD/03V
Manufacturer:
NXP USA Inc.
Ventron No:
4410251-MF1SEP1031DUD/03V
Description:
MIFARE CLASSIC SMART CARD IC
ECAD Model:
Datasheet:
MF1SEP1031DUD/03V

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Specifications
NXP USA Inc. MF1SEP1031DUD/03V technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MF1SEP1031DUD/03V.
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    Die
  • Operating Temperature
    -25°C~70°C
  • Packaging
    Bulk
  • Published
    2014
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Frequency
    13.56MHz
  • Interface
    UART
  • Standards
    ISO 14443
  • RoHS Status
    ROHS3 Compliant
Description
The MF1SEP1031DUD/03V is MIFARE CLASSIC SMART CARD IC , it is part of - series. they are designed to work as RFID, RF Access, Monitoring ICs.MF1SEP1031DUD/03V with pin details manufactured by NXP Semiconductors / Freescale. The MF1SEP1031DUD/03V is available in Die Package,it is part of the electronic component Chips.that includes - Series. they are designed to operate as RFID, RF Access, Monitoring ICs.it is with Operating Temperature -25°C ~ 70°C.MF1SEP1031DUD/03V with original stock manufactured by NXP Semiconductors / Freescale. The MF1SEP1031DUD/03V is available in Die Package.Generally IC chips offer Mounting Style features such as SMD/SMT, Package Case of MF1SEP1031DUD/03Vis designed to work in Die, it's Operating Temperature is -25°C ~ 70°C.The MF1SEP1031DUD/03V is available in Die Package, is part of the RFID, RF Access, Monitoring ICs and belong to RF/IF and RFID.MF1SEP1031DUD/03V with EDA / CAD Models manufactured by NXP Semiconductors / Freescale. The MF1SEP1031DUD/03V is available in DiePackage, is part of the RF/IF and RFID.The MF1SEP1031DUD/03V is RFID, RF Access, Monitoring ICs with package Die manufactured by NXP Semiconductors / Freescale. The MF1SEP1031DUD/03V is available in Die Package, is part of the MIFARE CLASSIC SMART CARD IC.
MF1SEP1031DUD/03V More Descriptions
Secure contactless smart card IC for seamless migration, RoHSNXP Semiconductors SCT
RFID Transponder IC 13.56MHz ISO 14443 UARTDie
IC RFID TRANSP 13.56MHZ DIE
Product Comparison
The three parts on the right have similar specifications to MF1SEP1031DUD/03V.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Frequency
    Interface
    Standards
    RoHS Status
    Series
    Reach Compliance Code
    Pin Count
    Source Url Status Check Date
    View Compare
  • MF1SEP1031DUD/03V
    MF1SEP1031DUD/03V
    16 Weeks
    Surface Mount
    Die
    -25°C~70°C
    Bulk
    2014
    Active
    1 (Unlimited)
    13.56MHz
    UART
    ISO 14443
    ROHS3 Compliant
    -
    -
    -
    -
    -
  • MF1S5037DUA,005
    -
    Surface Mount
    Die
    -25°C~70°C TA
    -
    2010
    Obsolete
    1 (Unlimited)
    13.56MHz
    -
    ISO 14443, MIFARE
    -
    MIFARE®
    -
    -
    -
  • MF1SEP1001DA8/03J
    16 Weeks
    Surface Mount
    MOA8, Smart Card Module
    -25°C~70°C
    Tape & Reel (TR)
    2014
    Active
    1 (Unlimited)
    13.56MHz
    UART
    ISO 14443
    ROHS3 Compliant
    -
    -
    -
    -
  • MF1S7030XDA4,118
    -
    Surface Mount
    MOA4, Smart Card Module
    -25°C~70°C
    Tape & Reel (TR)
    2010
    Obsolete
    1 (Unlimited)
    13.56MHz
    UART
    ISO 14443, MIFARE
    ROHS3 Compliant
    MIFARE®
    unknown
    35
    2013-10-15 00:00:00
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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