MCIMX6U5DVM10AC

NXP USA Inc. MCIMX6U5DVM10AC

Part Number:
MCIMX6U5DVM10AC
Manufacturer:
NXP USA Inc.
Ventron No:
3161162-MCIMX6U5DVM10AC
Description:
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
ECAD Model:
Datasheet:
MCIMX6U5DVM10AC

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Specifications
NXP USA Inc. MCIMX6U5DVM10AC technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MCIMX6U5DVM10AC.
  • Factory Lead Time
    15 Weeks
  • Package / Case
    624-LFBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TJ
  • Packaging
    Tray
  • Published
    2002
  • Series
    i.MX6DL
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    624
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    S-PBGA-B624
  • Supply Voltage-Max (Vsup)
    1.5V
  • Supply Voltage-Min (Vsup)
    1.35V
  • Speed
    1.0GHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Core Processor
    ARM® Cortex®-A9
  • Address Bus Width
    26
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    64
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    1.8V 2.5V 2.8V 3.3V
  • Ethernet
    10/100/1000Mbps (1)
  • Number of Cores/Bus Width
    2 Core 32-Bit
  • Graphics Acceleration
    Yes
  • RAM Controllers
    LPDDR2, LVDDR3, DDR3
  • USB
    USB 2.0 PHY (4)
  • Additional Interfaces
    CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
  • Co-Processors/DSP
    Multimedia; NEON™ SIMD
  • Security Features
    ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Display & Interface Controllers
    Keypad, LCD
  • Height Seated (Max)
    1.6mm
  • Length
    21mm
  • RoHS Status
    ROHS3 Compliant
Description
MCIMX6U5DVM10AC Overview
With a packing size of 624-LFBGA, this embedded microprocessor is ideal for international shipping. Advanced packaging method Tray is used to provide high reliability. There are 2 Core 32-Bit cores per bus width on the CPU. The operating temperature around 0°C~95°C TJ should be understood. The i.MX6DL series contains it. This CPU is cored with a ARM? Cortex?-A9 processor. A CPU with this architecture uses LPDDR2, LVDDR3, DDR3 RAM controllers. Microprocessors with CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces are designed to serve users better. As far as I/O is concerned, this CPU runs at 1.8V 2.5V 2.8V 3.3V. uPs/uCs/Peripheral ICs type is MICROPROCESSOR, RISC. Total terminations are 624. The maximum supply current is 1.5V. Its external data bus width is 64.

MCIMX6U5DVM10AC Features
ARM? Cortex?-A9 Core

MCIMX6U5DVM10AC Applications
There are a lot of NXP USA Inc. MCIMX6U5DVM10AC Microprocessor applications.

Smart highways (navigation, traffic control, information monitoring and car service)
Food and beverage
Instrumentation and process control field
Torpedo guidance
Washing machines
Computed Tomography (CT scan)
DVD\DV\MP3 players
Missile control
Electromechanical control
Day to day life field
MCIMX6U5DVM10AC More Descriptions
MPU i.MX 6 RISC 32-Bit 1000MHz 1.8V/2.5V/2.8V/3.15V 624-Pin MAPBGA Tray
I.mx 6 Series 32-Bit Mpu, Dual Arm Cortex-A9 Core, 1Ghz, Mapbga 624 Rohs Compliant: Yes
Processors - Application Specialized MCIMX6U5DVM10AC/LFBGA624///TRAY MULTIPLE DP BAKEAB
RISC Microprocessor, 1000MHz, CMOS, PBGA2240
i.MX6DL Series 3.3 V 1 GHz 32-Bit SMT Applications Processor - MAPBGA-624
128KB ARM-ASeries 1000MHz MAPBGA-624 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
MPU, CORTEX-A9, 32BIT, 1GHZ, MAPBGA-624; Product Range: i.MX Family i.MX 6DualLite Series Microprocessors; MPU Core Size: 32bit; Program Memory Size: -; No. of Pins: 624Pins; MPU Case Style: MAPBGA; Supply Voltage Min: 1.35V;
Product Comparison
The three parts on the right have similar specifications to MCIMX6U5DVM10AC.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Speed
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Address Bus Width
    Boundary Scan
    Low Power Mode
    External Data Bus Width
    Format
    Integrated Cache
    Voltage - I/O
    Ethernet
    Number of Cores/Bus Width
    Graphics Acceleration
    RAM Controllers
    USB
    Additional Interfaces
    Co-Processors/DSP
    Security Features
    Display & Interface Controllers
    Height Seated (Max)
    Length
    RoHS Status
    Base Part Number
    View Compare
  • MCIMX6U5DVM10AC
    MCIMX6U5DVM10AC
    15 Weeks
    624-LFBGA
    YES
    0°C~95°C TJ
    Tray
    2002
    i.MX6DL
    e1
    Active
    3 (168 Hours)
    624
    Tin/Silver/Copper (Sn/Ag/Cu)
    CMOS
    BOTTOM
    BALL
    260
    0.8mm
    40
    S-PBGA-B624
    1.5V
    1.35V
    1.0GHz
    MICROPROCESSOR, RISC
    ARM® Cortex®-A9
    26
    YES
    YES
    64
    FIXED POINT
    YES
    1.8V 2.5V 2.8V 3.3V
    10/100/1000Mbps (1)
    2 Core 32-Bit
    Yes
    LPDDR2, LVDDR3, DDR3
    USB 2.0 PHY (4)
    CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
    Multimedia; NEON™ SIMD
    ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
    Keypad, LCD
    1.6mm
    21mm
    ROHS3 Compliant
    -
    -
  • MCIMX233DAG4B
    -
    128-LQFP
    -
    -10°C~70°C TA
    Tray
    2004
    i.MX23
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    454MHz
    -
    ARM926EJ-S
    -
    -
    -
    -
    -
    -
    2.0V 2.5V 2.7V 3.0V 3.3V
    -
    1 Core 32-Bit
    No
    DRAM
    USB 2.0 PHY (1)
    I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
    Data; DCP
    Cryptography, Hardware ID
    LCD, Touchscreen
    -
    -
    ROHS3 Compliant
    MCIMX233
  • MCIMX233CJM4CR2
    10 Weeks
    169-LFBGA
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    2004
    i.MX23
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    454MHz
    -
    ARM926EJ-S
    -
    -
    -
    -
    -
    -
    2.0V 2.5V 2.7V 3.0V 3.3V
    -
    1 Core 32-Bit
    No
    DRAM
    USB 2.0 PHY (1)
    I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
    Data; DCP
    Cryptography, Hardware ID
    LCD, Touchscreen
    -
    -
    ROHS3 Compliant
    MCIMX233
  • MCIMX233CAG4B
    -
    128-LQFP
    -
    -40°C~85°C TA
    Tray
    -
    i.MX23
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    454MHz
    MICROPROCESSOR
    ARM926EJ-S
    -
    -
    -
    -
    -
    -
    2.0V 2.5V 2.7V 3.0V 3.3V
    -
    1 Core 32-Bit
    No
    DRAM
    USB 2.0 PHY (1)
    I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
    Data; DCP
    Cryptography, Hardware ID
    LCD, Touchscreen
    -
    -
    ROHS3 Compliant
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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