ON Semiconductor MC74HC03AN

MC74HC03AN Overview
The mounting type of this component is through hole, which means it is designed to be mounted by inserting its leads into holes on a printed circuit board. The packaging of this component is a tube, which provides protection and easy handling during transportation and storage. It was published in the year 2000, indicating its long-standing presence in the market. With 14 terminations, this component offers multiple connection points for various applications. Its terminal finish is tin/lead (Sn/Pb), which ensures reliable soldering. The packing method is RAIL, which allows for efficient organization and handling during assembly. The peak reflow temperature for this component is 235 degrees Celsius, ensuring its ability to withstand high-temperature soldering processes. With a power dissipation of 750mW, this component can handle a significant amount of power. It features 4 gates, making it suitable for applications that require multiple inputs and outputs. However, it is important to note that this component is non-RoHS compliant, meaning it contains substances that are restricted by the Restriction of Hazardous Substances directive.

MC74HC03AN Features
NAND Gate Logic Type
Operating Temperature: -55°C~125°C
HC/UH Family
Quiescent Current: 1μA
4 Gates

MC74HC03AN Applications
There are a lot of ON Semiconductor MC74HC03AN Gates and Inverters applications.

Electrical tools
Cell phone
Massager
Printer
Fax machine
Remote monitoring
Laptop
Flashlight
Pocket PC
Range hood