NXP USA Inc. MC68360ZQ25L

MC68360ZQ25L Overview
The Terminal Finish for this specific product is TIN LEAD, which ensures a durable and reliable finish. The Reflow Temperature-Max (s) is set at 40, ensuring that the product can withstand high temperatures without any damage. The JESD-30 Code for this product is S-PBGA-B357, indicating its surface mount packaging type. With a speed of 25MHz, this product is able to process data quickly and efficiently. The Boundary Scan feature is available for this product, allowing for easy testing and debugging. The Voltage - I/O is set at 5.0V, making it compatible with MC68040 and MC68030 bus systems. The Communication Protocol for this product is versatile, including options such as BISYNC, HDLC, ETHERNET, PROFIBUS, SS7 TRANSPARENT, X.21, V.14, UART, APPLE TALK, and DDCMP. The Data Encoding/Decoding Method includes various options such as NRZ, NRZI-MARK, NRZI-SPACE, BIPH-MARK (FM1), BIPH-SPACE (FM0), BIPH-LEVEL (MANCHESTER), and DIFF BIPH-LEVEL. The Height Seated (Max) for this product is 1.86mm, making it compact and easy to integrate into any system.

MC68360ZQ25L Features
CPU32 Core

MC68360ZQ25L Applications
There are a lot of NXP USA Inc. MC68360ZQ25L Microprocessor applications.

Missile control
Fax machines
Kindle
Industrial control field
Security systems
Entertainment products
Electrocardiogram (EKG)
Blood pressure monitors
Entertainment-radios, CD players, televisions
Computers and laptops-video calling, email, blogging