NXP USA Inc. MC33874BPNA
- Part Number:
- MC33874BPNA
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 4548025-MC33874BPNA
- Description:
- IC SW QUAD HI SIDE 35MOHM 24PQFN
- Datasheet:
- MC33874BPNA
NXP USA Inc. MC33874BPNA technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC33874BPNA.
- Mounting TypeSurface Mount
- Package / Case24-PowerQFN
- Operating Temperature-40°C~150°C TJ
- PackagingTray
- Published2005
- FeatureSlew Rate Controlled, Watchdog Timer
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Base Part NumberMC33874
- Number of Outputs4
- Output TypeN-Channel
- InterfaceSPI
- Output ConfigurationHigh Side
- Voltage - Supply (Vcc/Vdd)4.5V~5.5V
- Switch TypeGeneral Purpose
- Ratio - Input:Output1:1
- Voltage - Load6V~27V
- Fault ProtectionCurrent Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
- Rds On (Typ)35m Ω
- RoHS StatusROHS3 Compliant
MC33874BPNA Overview
The manufacturer of this component is NXP USA Inc., a company that specializes in producing PMIC - Power Distribution Switches and Load Drivers. This specific chip falls under the PMIC - Power Distribution Switches and Load Drivers category. It is designed to be mounted on a surface and comes in a 24-PowerQFN package. The operating temperature range for this chip is -40°C to 150°C TJ, and it was first released in 2005. One of its notable features is that it has a slew rate control and a watchdog timer. The interface used for this chip is SPI, and its output configuration is set to high side. The input to output ratio is 1:1, and it can handle loads with a voltage range of 6V to 27V. This chip is also compliant with the ROHS3 standards, which means it is environmentally friendly.
MC33874BPNA Features
MC33874BPNA Applications
There are a lot of NXP USA Inc. MC33874BPNA Power Switches ICs applications.
Telecom and Network Systems
Storage (HDDs, SSDs)
Notebook and Tablet Computers
Hot Swaps
PC Card Hot Swap
Solid State Drivers
Solid-State Drives
PDAs
HDD and SSD
Mobile Communication Devices
The manufacturer of this component is NXP USA Inc., a company that specializes in producing PMIC - Power Distribution Switches and Load Drivers. This specific chip falls under the PMIC - Power Distribution Switches and Load Drivers category. It is designed to be mounted on a surface and comes in a 24-PowerQFN package. The operating temperature range for this chip is -40°C to 150°C TJ, and it was first released in 2005. One of its notable features is that it has a slew rate control and a watchdog timer. The interface used for this chip is SPI, and its output configuration is set to high side. The input to output ratio is 1:1, and it can handle loads with a voltage range of 6V to 27V. This chip is also compliant with the ROHS3 standards, which means it is environmentally friendly.
MC33874BPNA Features
MC33874BPNA Applications
There are a lot of NXP USA Inc. MC33874BPNA Power Switches ICs applications.
Telecom and Network Systems
Storage (HDDs, SSDs)
Notebook and Tablet Computers
Hot Swaps
PC Card Hot Swap
Solid State Drivers
Solid-State Drives
PDAs
HDD and SSD
Mobile Communication Devices
MC33874BPNA More Descriptions
Lead Free AUTOMOTIVE NO LEAD RoHS Compliant (Type) 200μs 150C 5.5V 35mOhm
Analog / Mixed Signal ICs - Power Actuation 4X35MOHM QUAD HS
IC SW QUAD HI SIDE 35MOHM 24PQFN
55 A 4 CHANNEL PWM BASED PRPHL DRVR PQCC24
Analog / Mixed Signal ICs - Power Actuation 4X35MOHM QUAD HS
IC SW QUAD HI SIDE 35MOHM 24PQFN
55 A 4 CHANNEL PWM BASED PRPHL DRVR PQCC24
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