NXP USA Inc. MC33298P
- Part Number:
- MC33298P
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3839668-MC33298P
- Description:
- IC SWITCH SERIAL OCTAL 20-DIP
- Datasheet:
- MC33298P
NXP USA Inc. MC33298P technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC33298P.
- Package / CaseDIP
- Surface MountNO
- PackagingBulk
- JESD-609 Codee0
- Pbfree Codeno
- Number of Terminations20
- Terminal FinishTin/Lead (Sn/Pb)
- Max Operating Temperature150°C
- Min Operating Temperature-40°C
- SubcategoryPeripheral Drivers
- TechnologyBCDMOS
- Terminal PositionDUAL
- Terminal FormTHROUGH-HOLE
- Terminal Pitch2.54mm
- Number of Outputs8
- Qualification StatusNot Qualified
- Max Output Current1A
- Power Supplies59/16V
- InterfaceSPI
- Output ConfigurationLow Side
- Driver Number of Bits8
- Fault ProtectionOver Temperature, Over Voltage
- RoHS StatusRoHS Compliant
- Lead FreeContains Lead
MC33298P Overview
The package or case of this electronic component is DIP, which stands for Dual In-line Package. This means that the pins are arranged in two parallel rows, making it easy to insert into a circuit board. Unlike some other components, this one does not have surface mount technology, meaning it cannot be soldered directly onto the board. The terminal finish is made of Tin/Lead, also known as Sn/Pb, which is a common material used for soldering. With a minimum operating temperature of -40°C, this component can withstand extreme conditions. It utilizes BCDMOS technology and has a dual terminal position, with a pitch of 2.54mm. Although it is not yet qualified, it has a maximum output current of 1A and a driver number of bits of 8.
MC33298P Features
MC33298P Applications
There are a lot of Freescale Semiconductor, Inc. (NXP Semiconductors) MC33298P hot swap controllers applications.
Switch
Microcontrollers
Circuit power protectors
Servers
CompactPCI
Data communication systems
Distributed power systems
Solid state circuit breakers
Short circuit protection
Datacom
The package or case of this electronic component is DIP, which stands for Dual In-line Package. This means that the pins are arranged in two parallel rows, making it easy to insert into a circuit board. Unlike some other components, this one does not have surface mount technology, meaning it cannot be soldered directly onto the board. The terminal finish is made of Tin/Lead, also known as Sn/Pb, which is a common material used for soldering. With a minimum operating temperature of -40°C, this component can withstand extreme conditions. It utilizes BCDMOS technology and has a dual terminal position, with a pitch of 2.54mm. Although it is not yet qualified, it has a maximum output current of 1A and a driver number of bits of 8.
MC33298P Features
MC33298P Applications
There are a lot of Freescale Semiconductor, Inc. (NXP Semiconductors) MC33298P hot swap controllers applications.
Switch
Microcontrollers
Circuit power protectors
Servers
CompactPCI
Data communication systems
Distributed power systems
Solid state circuit breakers
Short circuit protection
Datacom
MC33298P More Descriptions
IC SWITCH SERIAL OCTAL 20-DIP
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