MC08XS6421BEKR2

NXP USA Inc. MC08XS6421BEKR2

Part Number:
MC08XS6421BEKR2
Manufacturer:
NXP USA Inc.
Ventron No:
3839660-MC08XS6421BEKR2
Description:
IC SWITCH HIGH SIDE 32SOIC
ECAD Model:
Datasheet:
MC08XS6421BEKR2

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Specifications
NXP USA Inc. MC08XS6421BEKR2 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC08XS6421BEKR2.
  • Factory Lead Time
    20 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    32-SSOP (0.295, 7.50mm Width) Exposed Pad
  • Operating Temperature
    -40°C~125°C TA
  • Packaging
    Tape & Reel (TR)
  • Pbfree Code
    yes
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Peak Reflow Temperature (Cel)
    260
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of Outputs
    4
  • Output Type
    N-Channel
  • Interface
    SPI
  • Current - Output (Max)
    5.5A 11A
  • Output Configuration
    High Side
  • Voltage - Supply (Vcc/Vdd)
    4.5V~5.5V
  • Switch Type
    General Purpose
  • Ratio - Input:Output
    1:1
  • Voltage - Load
    7V~18V
  • Fault Protection
    Current Limiting (Fixed), Open Load Detect, Over Temperature
  • Rds On (Typ)
    8m Ω, 21m Ω
  • RoHS Status
    ROHS3 Compliant
Description
MC08XS6421BEKR2 Overview
The NXP USA Inc. PMIC - Power Distribution Switches, Load Drivers chip is a highly versatile component that falls under the PMIC - Power Distribution Switches, Load Drivers category. With a Surface Mount mounting type and a Part Status of Not For New Designs, this chip offers a reliable solution for various applications. Its Reflow Temperature-Max (s) is NOT SPECIFIED, making it suitable for a wide range of environments. It features 4 outputs, an SPI interface, and a high output current of 5.5A 11A. Additionally, its Output Configuration is High Side and it can handle a voltage range of 7V~18V. This chip also offers advanced fault protection, including Current Limiting (Fixed), Open Load Detect, and Over Temperature features. With an Rds On (Typ) of 8m Ω and 21m Ω, this chip ensures efficient power distribution and load driving capabilities.

MC08XS6421BEKR2 Features

MC08XS6421BEKR2 Applications
There are a lot of NXP USA Inc. MC08XS6421BEKR2 Power Switches ICs applications.

Handheld Devices
Portable GPS Device
USB Protection
Hard Disk Drives
Solid-State Drives
Portable Devices
USB Power Distribution
Various applications equipped with buttons
Storage (HDDs, SSDs)
Wireless Modem Data Cards
MC08XS6421BEKR2 More Descriptions
High-Side Switch, 12V, Dual 8mOhms Dual 21mOhms SOICEP 32, Reel
Power Switch ICs - Power Distribution MC08XS6421BEK/HSOP32///REEL 13 Q1 DP
IC PWR SWITCH N-CHAN 1:1 32HSOP
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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