M7AFS600-1FG256I

Microsemi Corporation M7AFS600-1FG256I

Part Number:
M7AFS600-1FG256I
Manufacturer:
Microsemi Corporation
Ventron No:
4542256-M7AFS600-1FG256I
Description:
IC FPGA 119 I/O 256FBGA
ECAD Model:
Datasheet:
M7AFS600-1FG256I

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Specifications
Microsemi Corporation M7AFS600-1FG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M7AFS600-1FG256I.
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Factory Lead Time
    17 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Number of Pins
    256
  • Weight
    400.011771mg
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Series
    Fusion®
  • Published
    2015
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • Terminal Finish
    TIN LEAD/TIN LEAD SILVER
  • Technology
    CMOS
  • Voltage - Supply
    1.425V~1.575V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    1.5V
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    M7AFS600
  • Operating Supply Voltage
    1.5V
  • Number of I/O
    119
  • RAM Size
    13.5kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
    110592
  • Number of Gates
    600000
  • Max Frequency
    1.28205GHz
  • Speed Grade
    1
  • Number of Registers
    13824
  • Height
    1.2mm
  • Length
    17mm
  • Width
    17mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
Description
M7AFS600-1FG256I Overview
The package that contains this software is called 256-LBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 119 I/Os for better data transfer. In order for the device to operate, a supply voltage of 1.5V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.425V~1.575V battery. There are many types of FPGAs in the Fusion® series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~85°C TA while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 256 terminations. As far as the RAM bits are concerned, this device offers you a total of 110592. If you are looking for related parts, you can use the base part number M7AFS600 as a starting point. For the program to work properly, the RAM si13.5kBe of this FPGA module must reach 13.5kB GB in order to ensure normal operation. In this case, 256 pins are used in the design. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.5V supply voltage. As a basic building block, fpga semiconductor consists of 600000 gates. In order to store and transfer data, a total of 13824 registers are used. As fast as 1.28205GHz can be reached with this FPGA.

M7AFS600-1FG256I Features
119 I/Os
Up to 110592 RAM bits
256 LABs/CLBs
13824 registers


M7AFS600-1FG256I Applications
There are a lot of Microsemi Corporation
M7AFS600-1FG256I FPGAs applications.


Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
M7AFS600-1FG256I More Descriptions
FPGA Fusion Family 600K Gates 1282.05MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
M7Afs600-1Fg256I 256 Lfbga 17X17X1.7Mm Tray Rohs Compliant: Yes |Microchip M7AFS600-1FG256I
Fusion FPGA, ARM CoreMP7, 600K System Gates
FPGA - Field Programmable Gate Array 600K System Gates
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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