Microsemi Corporation M1A3P400-2FGG256

M1A3P400-2FGG256 Overview
There is a 256-LBGA package that includes this component. 178 I/Os are available for transferring data more efficiently. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.425V~1.575V is needed in order for fpga chips to operate. As part of the ProASIC3 series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. As a space-saving measure, this FPGA model is contained within Tray. There are 55296 RAM bits that are available with this device. In order to find related parts, you can use its base part number M1A3P400. There is a maximum RAM si6.8kBe of 6.8kB on this FPGA module, which is necessary to ensure the normal operation of the program. It has a total of 256 pins that are designed for it. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. This module is capable of operating at a maximum temperature of 70°C. 0°C should be higher than the operating temperature. There are 400000 gates that make up its basic building block. There is a device package provided by 256-FPBGA (17x17) as its supplier.

M1A3P400-2FGG256 Features
178 I/Os
Up to 55296 RAM bits
256 LABs/CLBs
70°C gates


M1A3P400-2FGG256 Applications
There are a lot of Microsemi Corporation
M1A3P400-2FGG256 FPGAs applications.


Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding