LPC2364FBD100

NXP LPC2364FBD100

Part Number:
LPC2364FBD100
Manufacturer:
NXP
Ventron No:
5548087-LPC2364FBD100
Description:
passive components in stock
ECAD Model:
Datasheet:
LPC2364FBD100

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Specifications
NXP LPC2364FBD100 technical specifications, attributes, parameters and parts with similar specifications to NXP LPC2364FBD100.
  • Mount
    Surface Mount
  • Package / Case
    LQFP
  • Number of Pins
    100
  • Termination
    SMD/SMT
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    -40°C
  • Frequency
    72MHz
  • Interface
    CAN, I2C, I2S, SPI, UART, USB
  • Max Supply Voltage
    3.6V
  • Min Supply Voltage
    3V
  • Memory Size
    128kB
  • Number of I/O
    70
  • RAM Size
    8kB
  • Memory Type
    FLASH
  • Peripherals
    DMA, PWM
  • Frequency (Max)
    72MHz
  • Number of Timers/Counters
    4
  • Density
    1 Mb
  • Core Architecture
    ARM
  • Number of ADC Channels
    6
  • Number of I2C Channels
    3
  • Number of Ethernet Channels
    1
  • Height
    1.45mm
  • Length
    14.1mm
  • Width
    14.1mm
  • REACH SVHC
    No SVHC
  • RoHS Status
    RoHS Compliant
Description
LPC2364FBD100  Description The LPC2364/65/66/67/68 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation that combines the microcontroller with up to 512 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical performance in interrupt service routines and DSP algorithms, this increases performance up to 30 % over Thumb mode. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with a minimal performance penalty.

LPC2364FBD100  Features ARM7TDMI-S processor, running at up to 72 MHz Up to 512 kB on-chip flash program memory with In-System Programming (ISP) and In-Application Programming (IAP) capabilities. Flash program memory is on the ARM local bus for high-performance CPU access. 8 kB/32 kB of SRAM on the ARM local bus for high-performance CPU access. 16 kB SRAM for Ethernet interface. Can also be used as a general-purpose SRAM. 8 kB SRAM for general purpose DMA use is also accessible by USB. Dual Advanced High-performance Bus (AHB) system that provides for simultaneous Ethernet DMA, USB DMA, and program execution from on-chip flash with no contention between those functions. A bus bridge allows the Ethernet DMA to access the other AHB subsystem. Advanced Vectored Interrupt Controller (VIC), supporting up to 32 vectored interrupts. General Purpose DMA controller (GPDMA) on AHB that can be used with the SSP serial interfaces, the I2S port, and the Secure Digital/MultiMediaCard (SD/MMC) card port, as well as for memory-to-memory transfers.

LPC2364FBD100 More Descriptions
MICROCONTROLLER MCU, 32 BIT, ARM7TDMI, 72MHZ, LQFP-100
RISC Microcontroller, 32-Bit, FLASH, ARM7 CPU, 72MHz, CMOS, PQFP100
MCU 32BIT ARM7, 10/100, USB, CAN; Controller Family/Series:LPC23xx; Core Size:32bit; No. of I/O's:70; Program Memory Size:128 KB; RAM Memory Size:8KB; CPU Speed:72MHz; Oscillator Type:External, Internal; No. of Timers:4; Peripherals:ADC, DAC, DMA, PWM, RTC, Timer; No. of PWM Channels:6; Digital IC Case Style:LQFP; Supply Voltage Range:3V to 3.6V; Operating Temperature Range:-40°C to 85°C; No. of Pins:100; Base Number:(ARM7); Clock Frequency:72MHz; Flash Memory Size:128KB; Interface:I2C, I2S, SPI, UART; Interface:CAN, I2C, I2S, SPI, USB, UART; Interface Type:CAN, SPI, USB, UART; Logic Function Number:2364; No. of ADC Inputs:6; No. of I/O's:70; Package / Case:LQFP; Peripherals:ADC, DAC, DMA, POR, RTC; Program Memory Size:128KB; Supply Voltage Max:3.6V; Supply Voltage Min:3V; Termination Type:SMD
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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