Lattice Semiconductor Corporation LFXP6C-3Q208C

LFXP6C-3Q208C Overview
The surface mount technology, also known as SMT, has become the standard for electronic packaging. One example of this is the 208-BFQFP package/case, which is a type of surface mount package commonly used in the industry. This package is part of the XP series, which is known for its high-performance capabilities. The Pbfree code for this package is "no," indicating that it does not contain any lead in its composition. The terminal finish for this package is Tin/Lead (Sn85Pb15), which is a common alloy used in electronic components. This package falls under the HTS code 8542.39.00.01, which is used for integrated circuits. The technology used in this package is CMOS, which stands for Complementary Metal-Oxide-Semiconductor. With a frequency of 320MHz and a RAM size of 9kB, this package is suitable for a wide range of applications. Additionally, it is a field programmable gate array (FPGA), meaning that it can be customized and programmed for specific functions.

LFXP6C-3Q208C Features
142 I/Os
Up to 73728 RAM bits
208 LABs/CLBs
750 logic blocks (LABs)
Operating from a frequency of 320MHz

LFXP6C-3Q208C Applications
There are a lot of Lattice Semiconductor Corporation LFXP6C-3Q208C FPGAs applications.

Scientific Instruments
Software-defined radios
Computer hardware emulation
Audio
Electronic Warfare
Medical imaging
ADAS
Medical ultrasounds
Security systems
Integrating multiple SPLDs