LFXP6C-3FN256I

Lattice Semiconductor Corporation LFXP6C-3FN256I

Part Number:
LFXP6C-3FN256I
Manufacturer:
Lattice Semiconductor Corporation
Ventron No:
3639199-LFXP6C-3FN256I
Description:
IC FPGA 188 I/O 256FBGA
ECAD Model:
Datasheet:
LFXPxx(C,E) Family

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Specifications
Lattice Semiconductor Corporation LFXP6C-3FN256I technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation LFXP6C-3FN256I.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-BGA
  • Number of Pins
    256
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2007
  • Series
    XP
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.71V~3.465V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1mm
  • Frequency
    320MHz
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    LFXP6
  • Pin Count
    256
  • Number of Outputs
    188
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.8V
  • Memory Size
    11.9kB
  • Number of I/O
    188
  • RAM Size
    20.8kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    6000
  • Total RAM Bits
    73728
  • Number of Gates
    2
  • Number of Logic Blocks (LABs)
    625
  • Combinatorial Delay of a CLB-Max
    0.63 ns
  • Number of CLBs
    720
  • Number of Logic Cells
    720
  • Length
    17mm
  • Width
    17mm
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Description
LFXP6C-3FN256I Overview
The XP series chip, produced by Lattice Semiconductor Corporation, falls under the category of Embedded-FPGAs (Field Programmable Gate Array). It has a surface mount mounting type and 256 pins, with a terminal form of BALL. The chip also boasts 188 outputs and I/O, and contains 720 logic cells. With a length and width of 17mm each, this chip is a compact yet powerful option for various electronic applications.

LFXP6C-3FN256I Features
188 I/Os
Up to 73728 RAM bits
256 LABs/CLBs
625 logic blocks (LABs)
Operating from a frequency of 320MHz

LFXP6C-3FN256I Applications
There are a lot of Lattice Semiconductor Corporation LFXP6C-3FN256I FPGAs applications.

Digital signal processing
Consumer Electronics
Bioinformatics
Wireless Communications
Solar Energy
Filtering and communication encoding
Defense Applications
Embedded Vision
Security systems
Wired Communications
LFXP6C-3FN256I More Descriptions
FPGA LatticeXP Family 6000 Cells 320MHz 130nm Technology 1.8V/2.5V/3.3V 256-Pin FBGA Tray
FPGA - Field Programmable Gate Array 5.8K LUTs 188 IO 1.8 /2.5/3.3V -3 Spd I
Complex Programmable Logic Devices - CPLDs 5.8K LUTs 188 IO 1.8 /2.5/3.3V -3 Spd I
XP LFXP6 256-BGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 17mm 1.8V 320MHz 0.63ns
LATTICEXP 5800 MC 375MHZ SRAM 1.8/2.5/3.3V 256 FPBGA
IC,LFXP6C-3FN256I,5.8K LUTS, 1 88 I/O, 1.8/2.5/3.3V, -3 SPEE
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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