Lattice Semiconductor Corporation LFXP20C-3FN256I
- Part Number:
- LFXP20C-3FN256I
- Manufacturer:
- Lattice Semiconductor Corporation
- Ventron No:
- 3822521-LFXP20C-3FN256I
- Description:
- IC FPGA 188 I/O 256FBGA
- Datasheet:
- LFXPxx(C,E) Family
Lattice Semiconductor Corporation LFXP20C-3FN256I technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation LFXP20C-3FN256I.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-BGA
- Number of Pins256
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2007
- SeriesXP
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- ECCN CodeEAR99
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.71V~3.465V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.8V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)40
- Base Part NumberLFXP20
- Pin Count256
- Number of Outputs188
- Qualification StatusNot Qualified
- Operating Supply Voltage1.8V
- Power Supplies1.8/2.5/3.3V
- Memory Size59.4kB
- Number of I/O188
- RAM Size49.5kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells20000
- Total RAM Bits405504
- Number of Gates4
- Max Frequency320MHz
- Number of Logic Blocks (LABs)2500
- Combinatorial Delay of a CLB-Max0.63 ns
- Height Seated (Max)2.1mm
- Length17mm
- Width17mm
- RoHS StatusRoHS Compliant
- Lead FreeLead Free
LFXP20C-3FN256I Overview
The specific product being discussed is a chip manufactured by Lattice Semiconductor Corporation. It falls under the category of Embedded - FPGAs (Field Programmable Gate Array) and is designed for use in embedded systems. This chip is designed for surface mounting and has 256 pins. It was first published in 2007. The terminal finish is made of Tin/Silver/Copper (Sn/Ag/Cu) and the supply voltage is 1.8V. The base part number for this chip is LFXP20. It has a memory size of 59.4kB and a capacity of 20000 logic elements/cells. The maximum frequency for this chip is 320MHz and the combinatorial delay of a CLB-Max is 0.63 ns.
LFXP20C-3FN256I Features
188 I/Os
Up to 405504 RAM bits
256 LABs/CLBs
2500 logic blocks (LABs)
LFXP20C-3FN256I Applications
There are a lot of Lattice Semiconductor Corporation LFXP20C-3FN256I FPGAs applications.
Military DSP
Data center hardware accelerators
Electronic Warfare
Telecommunication
Secure Communication
Voice recognition
ASIC prototyping
Digital signal processing
Software-defined radio
Random logic
The specific product being discussed is a chip manufactured by Lattice Semiconductor Corporation. It falls under the category of Embedded - FPGAs (Field Programmable Gate Array) and is designed for use in embedded systems. This chip is designed for surface mounting and has 256 pins. It was first published in 2007. The terminal finish is made of Tin/Silver/Copper (Sn/Ag/Cu) and the supply voltage is 1.8V. The base part number for this chip is LFXP20. It has a memory size of 59.4kB and a capacity of 20000 logic elements/cells. The maximum frequency for this chip is 320MHz and the combinatorial delay of a CLB-Max is 0.63 ns.
LFXP20C-3FN256I Features
188 I/Os
Up to 405504 RAM bits
256 LABs/CLBs
2500 logic blocks (LABs)
LFXP20C-3FN256I Applications
There are a lot of Lattice Semiconductor Corporation LFXP20C-3FN256I FPGAs applications.
Military DSP
Data center hardware accelerators
Electronic Warfare
Telecommunication
Secure Communication
Voice recognition
ASIC prototyping
Digital signal processing
Software-defined radio
Random logic
LFXP20C-3FN256I More Descriptions
FPGA - Field Programmable Gate Array 19.7K LUTs 188 IO 1. 8/2.5/3.3V-3 Spd I
IC FPGA 188 I/O 256FBGA
IC FPGA 188 I/O 256FBGA
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