Lattice Semiconductor Corporation LFXP2-17E-6FN484C

Name: LFXP2-17E-6FN484C
Brand: Lattice Semiconductor Corporation
SKU: 3126178-LFXP2-17E-6FN484C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: LFXP2-17E-6FN484C

Manufacturer:: Lattice Semiconductor Corporation

Ventron No:: 3126178-LFXP2-17E-6FN484C

Description:: IC FPGA 358 I/O 484FBGA

ECAD Model:

Datasheet:: LFXP2-17E-6FN484C

Specifications

Lattice Semiconductor Corporation LFXP2-17E-6FN484C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation LFXP2-17E-6FN484C.

Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
484-BBGA
Number of Pins
484
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
XP2
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
484
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.2V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Base Part Number
LFXP2-17
Pin Count
484
Number of Outputs
358
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Power Supplies
1.21.2/3.33.3V
Memory Size
38.9kB
Number of I/O
358
RAM Size
34.5kB
Clock Frequency
435MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
17000
Total RAM Bits
282624
Number of LABs/CLBs
2125
Combinatorial Delay of a CLB-Max
0.399 ns
Height Seated (Max)
2.6mm
Length
23mm
Width
23mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free

Description

LFXP2-17E-6FN484C Overview
The manufacturer of this component is Lattice Semiconductor Corporation. It is an Embedded - FPGAs (Field Programmable Gate Array) chip, which falls under the category of Embedded - FPGAs (Field Programmable Gate Array). It is designed to be mounted on the surface of a circuit board and can operate within a temperature range of 0°C to 85°C. This particular version was first published in 2009 and is currently still in active production. The technology used in this chip is CMOS. The terminals are located on the bottom of the chip and it has a total of 484 pins. The chip has a RAM size of 34.5kB and a combinational delay of 0.399 ns for a CLB-Max (Configurable Logic Block-Maximum). Its width measures 23mm.

LFXP2-17E-6FN484C Features
358 I/Os
Up to 282624 RAM bits
484 LABs/CLBs

LFXP2-17E-6FN484C Applications
There are a lot of Lattice Semiconductor Corporation LFXP2-17E-6FN484C FPGAs applications.

Military DSP
Wireless Communications
Solar Energy
Data center search engines
Aerospace and Defense
ADAS
Integrating multiple SPLDs
Data Center
OpenCL
Device controllers

LFXP2-17E-6FN484C More Descriptions

Latticexp2 ; 16.6K Luts; 1.2V Rohs Compliant: Yes |Lattice Semiconductor LFXP2-17E-6FN484C
17K LUTs 358 I/O Instant-on DSP 1.2V -6 Speed
XP2 LFXP2-17 484-BBGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 2.6mm 1.2V 435MHz 0.399ns

Certification