Lattice Semiconductor Corporation LFXP10C-4FN256I

LFXP10C-4FN256I Overview
The package or case for this product is a 256-BGA, which is designed to provide a compact and efficient solution for electronic components. It has a wide operating temperature range of -40°C to 100°C TJ, making it suitable for use in various environments. The product is also environmentally friendly, as it has a Pbfree code of yes and an ECCN code of EAR99. The terminal finish is Tin/Silver/Copper (Sn/Ag/Cu), which ensures good conductivity and durability. The terminal form is BALL, which is a common form for BGA packages. The reflow temperature-max (s) is 40, indicating the maximum temperature the package can withstand during reflow. The base part number is LFXP10, which identifies the specific product. This package does not have radiation hardening, but it is RoHS compliant, meaning it is free from hazardous substances.

LFXP10C-4FN256I Features
188 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
Operating from a frequency of 360MHz

LFXP10C-4FN256I Applications
There are a lot of Lattice Semiconductor Corporation LFXP10C-4FN256I FPGAs applications.

Data center search engines
Automotive advanced driver assistance systems (ADAS)
Secure Communication
Military Temperature
Software-defined radio
Computer hardware emulation
Image processing
Device controllers
High Performance Computing
ASIC prototyping