LFXP10C-3F256C

Lattice Semiconductor Corporation LFXP10C-3F256C

Part Number:
LFXP10C-3F256C
Manufacturer:
Lattice Semiconductor Corporation
Ventron No:
3133011-LFXP10C-3F256C
Description:
IC FPGA 188 I/O 256FBGA
ECAD Model:
Datasheet:
LFXPxx(C,E) Family

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Specifications
Lattice Semiconductor Corporation LFXP10C-3F256C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation LFXP10C-3F256C.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-BGA
  • Number of Pins
    256
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Series
    XP
  • Published
    2007
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.71V~3.465V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1mm
  • Frequency
    320MHz
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    LFXP10
  • Pin Count
    256
  • Number of Outputs
    188
  • Operating Supply Voltage
    1.8V
  • Power Supplies
    1.8/2.5/3.3V
  • Memory Size
    31.9kB
  • Number of I/O
    188
  • RAM Size
    27kB
  • Organization
    1216 CLBS
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    10000
  • Total RAM Bits
    221184
  • Number of Gates
    4
  • Number of Logic Blocks (LABs)
    1250
  • Combinatorial Delay of a CLB-Max
    0.63 ns
  • Number of CLBs
    1216
  • Number of Logic Cells
    1216
  • Length
    17mm
  • Height Seated (Max)
    2.1mm
  • Width
    17mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Lead Free
Description
LFXP10C-3F256C Overview
In the 256-BGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 188 I/O ports for more coherent data transfer. To form a fundamental building block, there are 10000 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.8V volts is required. FPGA parts like this belong to the Field Programmable Gate Arrays family. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.71V~3.465V-volt supply voltage required for the device to operate. The XP Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. A total of 188 outputs are incorporated into this device. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. 256 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 221184 bFpga chipss. You can find related parts by using the part number LFXP10, which is its base part number. It is crucial that the RAM si27kBe of this FPGA module reaches 27kB so that the program can run normally. In order to make it work, 256 pins have been designed. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.8V. There is a 1.8/2.5/3.3V power supply that is required to operate it. There are 4 gates in its basic building block. With a total of 256 pins, it is equipped with a high level of security. A basic building block of this system consists of 1250 logic blocks (LABs). For storing programs and data, this FPGA module embeds memory 31.9kB. For its architecture, 1216 CLB modules are used. The high efficiency of this device is provided by its 320MHz-frequency operation. During the construction of the building block, there are 1216 logic cells used.

LFXP10C-3F256C Features
188 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
1250 logic blocks (LABs)
Operating from a frequency of 320MHz


LFXP10C-3F256C Applications
There are a lot of Lattice Semiconductor Corporation
LFXP10C-3F256C FPGAs applications.


Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
LFXP10C-3F256C More Descriptions
FPGA LatticeXP Family 10000 Cells 320MHz 130nm Technology 1.8V/2.5V/3.3V 256-Pin FBGA Tray
1216CLBS XP LFXP10 256-BGA field programmable gate array 2.1mm 1.8V 320MHz 0.63ns
Complex Programmable Logic Devices - CPLDs 9.7K LUTs 188 IO 1.8 /2.5/3.3V -3 Spd
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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