LFX125EB-03F256C

Lattice Semiconductor Corporation LFX125EB-03F256C

Part Number:
LFX125EB-03F256C
Manufacturer:
Lattice Semiconductor Corporation
Ventron No:
3639510-LFX125EB-03F256C
Description:
IC FPGA 160 I/O 256FBGA
ECAD Model:
Datasheet:
LFX125EB-03F256C

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Specifications
Lattice Semiconductor Corporation LFX125EB-03F256C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation LFX125EB-03F256C.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-BGA
  • Number of Pins
    256
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2000
  • Series
    ispXPGA®
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Additional Feature
    ALSO OPERATES WITH 3.3V SUPPLY
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    2.3V~3.6V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    2.5V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    LFX125
  • Pin Count
    256
  • Number of Outputs
    160
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    2.5V
  • Power Supplies
    2.5/3.3V
  • Memory Size
    15.3kB
  • Number of I/O
    160
  • RAM Size
    11.5kB
  • Clock Frequency
    320MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    1936
  • Total RAM Bits
    94208
  • Number of Gates
    139000
  • Combinatorial Delay of a CLB-Max
    1.07 ns
  • Number of CLBs
    484
  • Height Seated (Max)
    2.1mm
  • Length
    17mm
  • Width
    17mm
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Lead Free
Description
LFX125EB-03F256C Overview
The surface mount technology, also known as SMT, has been widely adopted in electronic manufacturing due to its numerous benefits. This technology allows for the mounting of electronic components directly onto the surface of a printed circuit board, making it more compact and efficient. The JESD-609 code, which stands for the Joint Electron Device Engineering Council, specifies the requirements for surface mount technology. The e0 code indicates that the component is moisture-sensitive and requires special handling during assembly. The Pbfree code signifies that the component is lead-free, making it environmentally friendly. The programmable logic type for this component is a field-programmable gate array, which allows for customization and versatility. With a memory size of 15.3kB and a total RAM of 94208 bits, this component offers ample storage and processing capabilities. The terminal position for this component is at the bottom, and it operates on 2.5/3.3V power supplies. Additionally, the maximum seated height for this component is 2.1mm, making it ideal for compact electronic devices.

LFX125EB-03F256C Features
160 I/Os
Up to 94208 RAM bits
256 LABs/CLBs

LFX125EB-03F256C Applications
There are a lot of Lattice Semiconductor Corporation LFX125EB-03F256C FPGAs applications.

Ecosystem
Radar and Sensors
Electronic Warfare
Industrial IoT
Defense Applications
Wired Communications
Software-defined radio
Embedded Vision
Integrating multiple SPLDs
Cryptography
LFX125EB-03F256C More Descriptions
FPGA ispXPGA Family 139K Gates 1936 Cells 2.5V/3.3V Automotive 256-Pin FBGA
IC FPGA 160 I/O 256FPBGA
Field Programmable Gate Arrays - FPGAs .
OEMs, CMs ONLY (NO BROKERS)
Contact for details
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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