LFECP6E-3FN256I

Lattice Semiconductor Corporation LFECP6E-3FN256I

Part Number:
LFECP6E-3FN256I
Manufacturer:
Lattice Semiconductor Corporation
Ventron No:
3133116-LFECP6E-3FN256I
Description:
IC FPGA 195 I/O 256FBGA
ECAD Model:
Datasheet:
ECP, EC Family

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Specifications
Lattice Semiconductor Corporation LFECP6E-3FN256I technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation LFECP6E-3FN256I.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-BGA
  • Number of Pins
    256
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2006
  • Series
    ECP
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    LFECP6
  • Pin Count
    256
  • Number of Outputs
    195
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Power Supplies
    1.21.2/3.33.3V
  • Memory Size
    14.6kB
  • Number of I/O
    195
  • RAM Size
    11.5kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    6100
  • Total RAM Bits
    94208
  • Max Frequency
    340MHz
  • Number of Logic Blocks (LABs)
    768
  • Combinatorial Delay of a CLB-Max
    0.56 ns
  • Number of CLBs
    768
  • Height Seated (Max)
    2.1mm
  • Length
    17mm
  • Width
    17mm
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Description
LFECP6E-3FN256I Overview
The surface mount mounting type, which was first published in 2006, has become increasingly popular due to its compact and efficient design. This type of mounting allows for the 256-BGA package/case to be securely attached to the surface of a circuit board, eliminating the need for through-hole components. With a terminal pitch of 1mm, this package offers a high level of integration and reliability. The 195 outputs and 11.5kB RAM size make it suitable for a wide range of applications. The FIELD PROGRAMMABLE GATE ARRAY, with a maximum frequency of 340MHz, offers high-speed processing capabilities. The 768 CLBs and a combinatorial delay of 0.56 ns make it a powerful and versatile programmable logic type.

LFECP6E-3FN256I Features
195 I/Os
Up to 94208 RAM bits
256 LABs/CLBs
768 logic blocks (LABs)

LFECP6E-3FN256I Applications
There are a lot of Lattice Semiconductor Corporation LFECP6E-3FN256I FPGAs applications.

Computer hardware emulation
Radar and Sensors
Digital signal processing
Device controllers
Development Boards and Shields for Microcontrollers
ADAS
Cryptography
Integrating multiple SPLDs
Embedded Vision
Wired Communications
LFECP6E-3FN256I More Descriptions
Field Programmable Gate Arrays - FPGAs 6.1 LUT, 195 I/O
IC FPGA 195 I/O 256FBGA
IC FPGA 195 I/O 256BGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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