Lattice Semiconductor Corporation LFE2M100E-5FN900I

LFE2M100E-5FN900I Overview
The package or case for this particular electronic component is a 900-BBGA, which stands for Ball Grid Array with 900 balls. It is packaged in a tray for easy handling and storage. The series of this component is ECP2M, which refers to the specific model or type. The JESD-609 code for this component is e1, indicating its compliance with industry standards. The terminal form is BALL, meaning that the connections are made through small balls on the bottom of the component. The terminal pitch, or distance between the balls, is 1mm. The maximum reflow temperature for this component is 30 seconds. It is important to note that this component is not yet qualified, meaning it has not undergone testing and certification. It has 416 input/output connections and contains 95000 logic elements or cells.

LFE2M100E-5FN900I Features
416 I/Os
Up to 5435392 RAM bits
900 LABs/CLBs

LFE2M100E-5FN900I Applications
There are a lot of Lattice Semiconductor Corporation LFE2M100E-5FN900I FPGAs applications.

High Performance Computing
ASIC prototyping
Wireless Communications
Security systems
Radar and Sensors
Consumer Electronics
Filtering and communication encoding
Server Applications
Cryptography
Electronic Warfare