LCMXO1200E-3FTN256I

Lattice Semiconductor Corporation LCMXO1200E-3FTN256I

Part Number:
LCMXO1200E-3FTN256I
Manufacturer:
Lattice Semiconductor Corporation
Ventron No:
3127195-LCMXO1200E-3FTN256I
Description:
IC FPGA 211 I/O 256FTBGA
ECAD Model:
Datasheet:
LCMXO1200E-3FTN256I

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Specifications
Lattice Semiconductor Corporation LCMXO1200E-3FTN256I technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation LCMXO1200E-3FTN256I.
  • Factory Lead Time
    8 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Number of Pins
    256
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    MachXO
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    LCMXO1200
  • Pin Count
    256
  • Number of Outputs
    211
  • Operating Supply Voltage
    1.2V
  • Operating Supply Current
    18mA
  • Number of I/O
    211
  • Nominal Supply Current
    18mA
  • Memory Type
    SRAM
  • Propagation Delay
    5.1 ns
  • Turn On Delay Time
    5.1 ns
  • Programmable Logic Type
    FLASH PLD
  • Number of Logic Elements/Cells
    1200
  • Total RAM Bits
    9421
  • Max Frequency
    500MHz
  • Number of LABs/CLBs
    150
  • Output Function
    MACROCELL
  • Number of Macro Cells
    600
  • Number of Dedicated Inputs
    7
  • Height Seated (Max)
    1.55mm
  • Length
    17mm
  • Width
    17mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
LCMXO1200E-3FTN256I Overview
The Lattice Semiconductor Corporation offers a highly advanced Embedded - FPGAs (Field Programmable Gate Array) chip that falls under the category of Embedded - FPGAs (Field Programmable Gate Array). This chip comes in a 256-LBGA package and has a JESD-609 Code of e1. It is also Pbfree with 256 terminations and operates at a voltage supply of 1.14V~1.26V. The peak reflow temperature for this chip is 260 degrees Celsius and it has a propagation delay of 5.1 ns. With 150 LABs/CLBs, the Lattice Semiconductor Corporation's chip offers a powerful output function of MACROCELL and measures 17mm in width.

LCMXO1200E-3FTN256I Features
211 I/Os
Up to 9421 RAM bits
256 LABs/CLBs

LCMXO1200E-3FTN256I Applications
There are a lot of Lattice Semiconductor Corporation LCMXO1200E-3FTN256I FPGAs applications.

Wired Communications
Voice recognition
Integrating multiple SPLDs
Device controllers
Automation
Industrial IoT
Development Boards and Shields for Microcontrollers
Solar Energy
Security systems
Computer hardware emulation
LCMXO1200E-3FTN256I More Descriptions
Lattice Machxo ; 1200 Luts; 1.2V Rohs Compliant: Yes |Lattice Semiconductor LCMXO1200E-3FTN256I
Complex Programmable Logic Devices - CPLDs 1200 LUTs 211 IO 1.2 V -3 Spd I
CPLD MachXO Family 600 Macro Cells 1.2V 256-Pin FTBGA Tray
FPGA - Field Programmable Gate Array 1200 LUTs 211 IO 1.2 V -3 Spd I
IC,LCMXO1200E-3FTN256I,1200 LU TS, 211 I/O, 1.2V, -3 SPEED,
1200 LUTs 211 I/O 1.2V -3 Speed IND
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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